金属学报  2005, Vol. 41 Issue (7): 743-749

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低熔点Sn--Zn--Bi无铅钎料的组织和性能

周 健 孙扬善 薛 烽

东南大学材料科学与工程系; 南京 210096

Microstructures and Properties of Sn-Zn-Bi Solder Alloys

ZHOU Jian; SUN Yangshan; XUE Feng

Department of Materials Science and Engineering; Southeast University; Nanjin 210096

周健; 孙扬善; 薛烽 . 低熔点Sn--Zn--Bi无铅钎料的组织和性能[J]. 金属学报, 2005, 41(7): 743-749 .
, , . Microstructures and Properties of Sn-Zn-Bi Solder Alloys[J]. Acta Metall Sin, 2005, 41(7): 743-749 .

摘要 参考文献 相关文章 Metrics 全文: PDF(386 KB)   摘要: 研究了Sn--Zn--Bi钎料的组织、相变及润湿性.在Sn--9Zn二元共晶的基础上加入质量分数为(2---10)%的Bi，合金结晶过程中形成富Zn的初生相。这导致合金的结晶温度降低, 也标志着熔点的降低, 但熔程扩大. 在加Bi基础上, 适当降低Zn的含量则可以缩小熔程, 且熔点无明显变化。Bi的加入明显改善了Si--Zn系钎料的润湿性, 提高了钎料在Cu基底上的铺展面积,缩短了润湿时间。钎料中Zn原子向Cu基底的扩散而形成扩散反应层,导致钎料熔体Cu界面能的下降。因此, 钎料中Zn含量提高, 其在Cu基底上的铺展面积增大, 润湿力提高。而由于扩散过程需要一定时间,导致润湿时间延长。因此,必须合理控制Zn的含量以获得铺展性与润湿时间的良好匹配。 关键词 ： Sn--Zn--Bi钎料,  熔点,  润湿性     Abstract：The microstructures, phase transformations and wetting behaviors of the Sn--Zn--Bi solders were investigated. The results show that adding 2\%---10\% Bi(mass fraction) to Sn--9Zn binary alloy, the primary Zn rich phase appears from the melts firstly on cooling, which results an increase of the pasty ranges. The crystallizing points decrease with addition of Bi, indicating a decrease of the melting points. Fixing Bi concentration, reduction of Zn decreases the pasty ranges, and the melting points keep stable. Addition of Bi improves the wettabilities, because the wetting areas on Cu substrates of the alloys are increased, and the wetting times are shorten. The diffusion of Zn into Cu at the solder/Cu interface is accelerated by increaseing Zn concentration, which decreases the solder/Cu interfacial energy. With addition of Zn, the wetting areas on Cu substrates of the Sn--Zn--Bi solders increase and the wetting forces enhance. But the diffusion needs a period of time, which means a prolonged wetting time. Therefore, Zn concentration must be controlled in order to obtain a good matching between the spreading area and the wetting time. Key words： Sn--Zn--Bi solder    melting point    wettability 收稿日期: 2004-09-14      ZTFLH:  TN604   服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 周健 孙扬善 薛烽 44.8K 链接本文: https://www.ams.org.cn/CN/      或      https://www.ams.org.cn/CN/Y2005/V41/I7/743 [1]Mulugeta A,Cuna S．Mater Sci Eng,2000;27:95 [2]Katsuki S．Surr Opin Solid State Mater Sci,2001;5:55 [3]McCormack M,Kammlot G W,Chen H S,Jin S．Appl Phys Lett,1994;9:1100 [4] Sung KK,Amit K S．J Electron Mater,1994;8:701 [5]Zhang L,Xian A P,Wang z G,Han E H,Shang J K．Acta Metall Sin,2004;40:1151 (张黎,冼爱平,王中光,韩恩厚,尚建库．金属学报,2004; 40:1151) [6]Shiue R K,Tsay L W,Lin C L,Qn J L．Microelectron Reliab,2003;43:453 [7] Katsuaki S,Toshikazu M,Hiroji N,Yoshitaka T．J Mater Res,2000;4:884 [8]Wu C M L,Yu D Q,Law C M T,Wang L．J Electron Mater,2000;9:921 [9]Kim Y S,Kim K S,Hwang C W,Katsuaki S．J Alloys Compd,2003;352:237 [10]Taguchi,Toshihiko,Katoh,Rikiya,Toyodo,Yoshitaka USP 6503338,2003 [11]Nakatsuka,Tetsuya,Soga,Soga,Tasao,Shimokawa, Hanae,Yamamoto,Kenichi,Harada,Masahide,Ochiai, Yuuji,Kamei,Tsuneaki．USP5942185,1999 [12]Lin W H,Chuang T H．J Mater Eng Perfor,2003;12: 452 [13] Pierre V,Alan P,Okamoto H．Handbook of Ternary Alloy Phase Diagrams．Washington D．C:ASM,1995 [14] Kim H．A Dissertation Submitted for the Degree Doctor of University of California,Los Angeles:UMI Company, 1996:42 [1] 姚彦桃, 陈礼清, 王文广. 原位反应浸渗法制备(B4C+Ti)混杂增强Mg及AZ91D复合材料及其阻尼性能[J]. 金属学报, 2019, 55(1): 141-148. [2] 孙磊,陈明和,张亮,杨帆. Sn-Ag-Cu钎料焊接显微组织演化和性能研究[J]. 金属学报, 2017, 53(5): 615-621. [3] 薛鹏, 张星星, 吴利辉, 马宗义. 搅拌摩擦焊接与加工研究进展*[J]. 金属学报, 2016, 52(10): 1222-1238. [4] 陈晓燕,金喆,白雪峰,周亦胄,金涛,孙晓峰. C对一种镍基高温合金与陶瓷型壳界面反应及润湿性的影响*[J]. 金属学报, 2015, 51(7): 853-858. [5] 李双明, 耿振博, 胡锐, 刘毅, 罗锡明. 高熔点金属区域熔炼中晶体生长角和凝固速率对熔区稳定性的影响[J]. 金属学报, 2015, 51(1): 114-120. [6] 陈晓燕, 周亦胄, 张朝威, 金涛, 孙晓峰. Hf对一种高温合金与陶瓷材料润湿性及界面反应的影响*[J]. 金属学报, 2014, 50(8): 1019-1024. [7] 马国峰,贺春林, 李正坤,张波,李宏,张海峰,胡壮麒. Ti或Al添加对Zr50Cu50非晶合金W润湿行为和界面特性的影响[J]. 金属学报, 2013, 29(4): 495-500. [8] 陈波; 熊华平; 毛唯; 程耀永; 李晓红 . Pd-Ni-(Cr, V)基高温钎料对Si3N4陶瓷的润湿及界面反应[J]. 金属学报, 2008, 44(10): 1260-1264 . [9] 王海龙; 王秀喜; 梁海弋 . 金属Cu体熔化与表面熔化行为的分子动力学模拟与分析[J]. 金属学报, 2005, 41(6): 568-572 . [10] 蒋绍坚; 周孑民 . Pb, Zn和Al在熔点附近的导热系数测试[J]. 金属学报, 2000, 36(3): 334-336 . [11] 刘耀辉;于思荣;何镇明;李庆春. Ce对Al_2O_3/中锰钢界面润湿性的影响及其机理[J]. 金属学报, 1991, 27(1): 126-129. [12] 边茂恕;陈秋;王景唐. 液态Al和Al-RE合金的密度、表面张力及对BN的润湿性和附着功[J]. 金属学报, 1988, 24(2): 207-209. Viewed Full text Abstract Cited   Shared      Discussed