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等温时效对SnAg/Cu表面贴装焊点微结构及剪切强度的影响 |
肖克来提 盛玫 |
中国科学院上海冶金研究所-戴姆勒克莱斯勒联合电子封装研究实验室; 上海 200050 |
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引用本文:
肖克来提; 盛玫 . 等温时效对SnAg/Cu表面贴装焊点微结构及剪切强度的影响[J]. 金属学报, 2000, 36(7): 697-702 .
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