Acta Metall Sin  2011, Vol. 47 Issue (5): 611-619    DOI: 10.3724/SP.J.1037.2011.00063

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EFFECT OF THE CROSS-INTERACTION ON THE FORMATION AND EVOLUTION OF INTERMETALLIC COMPOUNDS IN Cu(Ni)/Sn-Ag-Cu/Cu(Ni) BGA STRUCTURE SOLDER JOINTS

LI Xunping, ZHOU Minbo, XIA Jianmin, MA Xiao, ZHANG Xinping

School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640

LI Xunping ZHOU Minbo XIA Jianmin MA Xiao ZHANG Xinping. EFFECT OF THE CROSS-INTERACTION ON THE FORMATION AND EVOLUTION OF INTERMETALLIC COMPOUNDS IN Cu(Ni)/Sn-Ag-Cu/Cu(Ni) BGA STRUCTURE SOLDER JOINTS. Acta Metall Sin, 2011, 47(5): 611-619.

Abstract References Related Articles Recommended Metrics Download:  PDF(1606KB)  Export:  BibTeX | EndNote (RIS)       Abstract  The formation and evolution of interfacial intermetallic compounds (IMCs) in Cu(Ni)/Sn-3.0Ag-0.5Cu/Cu(Ni) BGA (Ball Grid Array) structure solder joints both in the as-reflowed state and undergoing isothermal aging at 125℃ were investigated. The results show that there exists a significant cross-interaction effect of the solder pad/under bump metal (UBM) on the composition, morphology and growth kinetics of interfacial IMCs in solder joints. The reactions of solder/Ni UBM strongly depends on the Cu content of the solder, for a high Cu content, a continuous (Cu, Ni)6Sn5 layer forms at the interface, while for a low Cu content, a continuous (Ni, Cu)3Sn4 layer appears at the interface. The cross-interaction of Cu and Ni in Cu/Sn-3.0Ag-0.5Cu(SAC)/Ni solder joints has obvious influence on the composition and morphology of the interfacial IMC; and the IMC spalling phenomenon occurs at the interface of Ni side. During isothermal aging at 125℃, the growth rate constant of the interfacial IMC layer in SAC/Cu and Cu/SAC/Cu joints increases with the Cu concentration, and the cross-interaction of Cu and Cu decreases the interfacial IMC growth rate constant at once-reflowed Cu side. However, both of the cross-interactions of Cu-Ni and Ni-Ni increase the growth rate constant of the interfacial IMC at once-reflowed Ni side and Ni has a greater influence than Cu. The cross-interaction of Cu and Ni is beneficial for suppression of growth of Cu3Sn and reduction the growth rate of IMC at Cu side, while having no significant influence on the porosity of Kirkendall voids in Cu3Sn layer at Cu side of the joint. Key words:  lead-free solder joint      cross-interaction of interface      intermetallic compounds      Kirkendall void      spalling phenomenon      Received:  27 January 2011      ZTFLH:  TG401     TG111   Fund:  Supported by Program of New Century Excellent Talents in University (No.NCET-04-0824) and Science and Technology Major Project of Guangdong Province (No.2009A080204005) Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors LI Xun-Beng ZHOU Min-Bei YAN Jian-Min MA Xiao ZHANG Xin-Beng URL:  https://www.ams.org.cn/EN/10.3724/SP.J.1037.2011.00063     OR     https://www.ams.org.cn/EN/Y2011/V47/I5/611 [1] Alam M O, Chan Y C. Chem Mater, 2003; 15: 4340 [2] Tsai C M, Luo W C, Chang C W, Shieh Y C, Kao C R. J Electro Mater, 2004; 33: 12 [3] Yoon J W, Jung S B. J Alloys Compd, 2008; 448: 177 [4] Wang Y W, Chang C C, Kao C R. J Alloys Compd, 2009; 478:L1 [5] Ho C E, Lin Y L, Kao C R. Chem Mater, 2002; 14: 949 [6] Lee J H, Shin D H, Kim Y S. Met Mater Int, 2003; 9: 577 [7] Hong K K, Ryu J B, Park C Y, Huh J Y. J Electro Mater, 2008; 37: 61 [8] Zhou M B, Li X P, Ma X, Zhang X P. Acta Metall Sin, 2010; 46: 569 (周敏波, 李勋平, 马骁, 张新平. 金属学报. 2010; 46: 569) [9] Jang G Y, Duh J G. J Electro Mater, 2006; 35:2061 [10] Ahat S, Sheng M, Luo L. J Electro Mater, 2001; 30:1317 [11] Tsai J Y, Hu YC, Tsai C M, Kao C R. J Electro Mater, 2003; 32: 1203 [12] Jeon Y D, Nieland S, Ostmann A, Reichl H, Paik K W. J Electro Mater, 2003; 32: 548 [13] He M, Lau W H, Qi G J, Chen Z. Thin Solid Films, 2004; 462–463: 376 [14] Vuorinen V, Yu H, Laurila T, Kivilahti J K. J Electro Mater, 2008; 37: 792 [15] Chen H T, Wang C Q, Li M Y, Tian D W. Mater Lett, 2006; 60: 1669 [16] Vuorinen V, Laurila T, Mattila T, Heikinheimo E, Kivilahti J K. J Electro Mater, 2007; 36: 1355 [17] Gagkuano R A, Fine E M. J Electron Mater, 2003; 32: 1441 [18] Takenaka T, Kano S, Kajihara M, Kurokawa N, Sakamoto K. Mater Sci Eng, 2005; A396: 115 [19] Wang S J, Liu C Y. J Electro Mater, 2006; 35: 1955 [20] Yoon JW, Kim B K, Shur C C, Jung S B. J Alloys Compd, 2009; 486: 142 [21] Gao F, Takemoto T, Nishikawa H. Mater Sci Eng, 2006; A420: 39 [22] Zeng K J, Stierman R, Chiu TC, Edwards D. J Appl Phys, 2005: 024508 [23] Blair H D, Pan T Y, Nicholson J M. 48th Electronic Components Technology Conference, USA: IEEE, 1998: 259 [24] Gong J C, Liu C Q, Conway P P, Silberschmidt V V. Acta Mater, 2008; 56: 4291 [25] Gao F, Choi S, Subramanian K N, Bieler T R, Lucas J P, Achari A, Paruchuri M. Mater Sci Eng, 2003; A351: 190 [1] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [2] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [3] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [4] Yanli LU,Guangming LU,Tingting HU,Tao YANG,Zheng CHEN. PHASE FIELD CRYSTAL STUDY ON THE FORMATION AND EVOLUTION OF PHASE BOUNDARY VOID INDUCED BY THE KIRKENDALL EFFECT[J]. 金属学报, 2015, 51(7): 866-872. [5] Wenjing MA,Changbo KE,Minbo ZHOU,Shuibao LIANG,Xinping ZHANG. PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM[J]. 金属学报, 2015, 51(7): 873-882. [6] ZHOU Dianwu, PENG Yan, XU Shaohua, LIU Jinshui. MICROSTRUCTURE AND MECHANICAL PROPERTY OF STEEL/Al ALLOY LASER WELDING WITH Sn POWDER ADDITION[J]. 金属学报, 2013, 49(8): 959-968. [7] TIAN Yanhong YANG Shihua WANG Chunqing WANG Xuelin LIN Pengrong. VOLUME EFFECT OF SHEAR FRACTURE BEHAVIOR OF Sn3.0Ag0.5Cu/Cu LEAD-FREE SOLDER JOINTS[J]. 金属学报, 2010, 46(3): 366-371. [8] Dong Xing-Long; Jun-Peng Lei. Prediction of the primary intermetallic compound formed in Fe(Ni)-Sn nanoparticles system[J]. 金属学报, 2008, 44(8): 922-926 . [9] . EFFECT OF INTERMETALLIC COMPOUNDS ON THE TENSILE PROPERTIES OF Sn-3.8Ag-0.7Cu SOLDER ALLOY[J]. 金属学报, 2007, 42(1): 41-46 . No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed