Abstract Specific non-wetting lines with a definite width of 200 μm were prepared on copper substrates. The dewetting of SnAgCu lead-free liquids on the non-wetting line were observed and recorded in-situ during the reflow of the samples. It was found that the shapes of the solder liquids varied with the height of the printed solder paste. As the height decreasing from 950 μm, the separation length of the liquid along the non-wetting line was elongated gradually. For the solder paste with a height of 350 μm, the liquid sphere cap was completely separated by the non-wetting line. The dependence of the critical height of the solder liquid on the width of non-wetting line was proposed based on interfacial energy minimization. The experimental data was comparable. These results gave a clear hint on the origin of solder bridge.
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JIANG Wenbiao Department of Matericls Science and Engineering;Nanjing Institute of Technology;Nanjing;LIU Youpeng;SHU Guangji Nanjing Institute of Technology. WETTING OF GRAPHITE BY LIQUID ALUMINIUM[J]. 金属学报, 1988, 24(2): 214-217.
