Acta Metall Sin  2004, Vol. 40 Issue (7): 716-720     DOI:

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RELATIONSHIP BETWEEN THE YIELD STRENGTH AND ANNEALING TEMPERATURE OF A Cu FILM ADHERENT TO SUBSTRATE

QIN Ming; JI Vincent (JI Ning); LI Jiabao; MA Suyuan; CHEN Changrong; SONG Zhongxiao; HE Jiawen

Shenyang National Laboratory for Materials Science; Institute of Metal Research; The Chinese Academy of Sciences; Shenyang 110016

QIN Ming; JI Vincent JI Ning; LI Jiabao; MA Suyuan; CHEN Changrong; SONG Zhongxiao; HE Jiawen. RELATIONSHIP BETWEEN THE YIELD STRENGTH AND ANNEALING TEMPERATURE OF A Cu FILM ADHERENT TO SUBSTRATE. Acta Metall Sin, 2004, 40(7): 716-720 .

Abstract References Related Articles Recommended Metrics Download:  PDF(876KB)  Export:  BibTeX | EndNote (RIS)       Abstract  Using X--ray tensile test, the relationship between the yield strength and annealing temperature for a Cu film with biaxial residual stress adherent to substrate was investigated. The results indicate that the proof stress of the film decreases with increasing annealing temperature. When annealing temperature rose from 150℃ to 300℃, the decreasing amplitude of proof stress is the largest. The reason of this phenomenon is that recrystallization in film occurred at 300℃, and a majority of structure strengthening effects disappeared. The yield strength of the Cu film on the steel substrate is greatly higher than that of block Cu. Key words:  Cu film      biaxial stress      yield strength       Received:  15 July 2003      ZTFLH:  TG113.25   Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors QIN Ming JI Vincent JI Ning LI Jiabao MA Suyuan CHEN Changrong SONG Zhongxiao HE Jiawen URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y2004/V40/I7/716 [1] Oliva A I, Quintana P, Ceh O, Corona J E, Aguilar M.Thin Solid Films, 1999; 353: 1 [2] Hummel R E. Int Mater Rev, 1994; 39: 97 [3] d'Heurle F M. Proc IEEE, 1971; 59: 1409 [4] Flinn P A. J Mater Res, 1991; 6: 1498 [5] Murarka S P. Mater Sci Eng R, 1997; 19: 87 [6] Ma D J, Xu K W, He J W. Acta Metall Sin, 1999; 35: 1049(马德军,徐可为,何家文.金属学报, 1999;35:1049) [7] Bell T J, Field J S, Swain M V. Mater Res Soc Symp Proc,1992; 239: 331 [8] Mearini G T, Hoffman R W. J Electron Mater, 1993; 22:623 [9] D'Antonio C, Hirschhorn J, Tarshis L. 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