Acta Metall Sin  1996, Vol. 32 Issue (1): 80-84    DOI:

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MECHANISM OF INTERACTION BETWEEN BASE ALUMINUM AND MOLTEN EUTECTIC Sn-Zn ALLOY

CHEN Rong; ZHANG Qiyun (Peking University; Beijing 100871)(Manuscript received 1995-04-04; in revised form 1995-07-12)

CHEN Rong; ZHANG Qiyun (Peking University; Beijing 100871)(Manuscript received 1995-04-04; in revised form 1995-07-12). MECHANISM OF INTERACTION BETWEEN BASE ALUMINUM AND MOLTEN EUTECTIC Sn-Zn ALLOY. Acta Metall Sin, 1996, 32(1): 80-84.

Abstract References Related Articles Recommended Metrics Download:  PDF(347KB)  Export:  BibTeX | EndNote (RIS)       Abstract  Two interfacial reactions of the eutectic Sn-Zn alloy as filler on the Al substrate during soldering were indicated, i.e., Zn in filler penetrating into Al grain boundaries to form Al-Zn solid solution, and some needle-like Al-Sn-Zn solid solution phases forming and growing into Sn-Zn solid solution. The above reactions make the bonding between filler and substrate to be strengthened more and more.Correspondent: CHEN Rong,(Department of Chemistry, Peking University, Beijing 100871) Key words:  eutectic Sn-Zn alloy      soldering      Al substrate      Received:  18 January 1996      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1996/V32/I1/80 1陈荣,张启运．第七届全国钎焊和扩散焊技术交流会文集,金华,1994:912张启运,刘淑祺,许亚平．金属学报,1992,28:A420 [1] Jihou LIU,Hongyun ZHAO,Zhuolin LI,Xiaoguo SONG,Hongjie DONG,Yixuan ZHAO,Jicai FENG. Microstructures and Mechanical Properties of Cu/Sn/Cu Structure Ultrasonic-TLP Joint[J]. 金属学报, 2017, 53(2): 227-232. [2] WANG Hui HE Siyuan CHU Xuming HE Deping . INTERFACIAL STRUCTURE AND MECHANICAL PROPERTIES OF ALUMINIUM FOAM JOINTS FLUXLESS--SOLDERED WITH Zn--Al--Cu BASE ALLOY[J]. 金属学报, 2009, 45(6): 723-728. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed