PLASMA CHEMICAL VAPOUR DEPOSITION OF Ti-N-C FILMS

Acta Metall Sin

1993, Vol. 29

Issue (1): 87-92 DOI:

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PLASMA CHEMICAL VAPOUR DEPOSITION OF Ti-N-C FILMS

ZHAO Cheng;PENG Hongrui;LI Shizhi Qingdao Institute of Chemical Technology

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ZHAO Cheng;PENG Hongrui;LI Shizhi Qingdao Institute of Chemical Technology. PLASMA CHEMICAL VAPOUR DEPOSITION OF Ti-N-C FILMS. Acta Metall Sin, 1993, 29(1): 87-92.

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Abstract Plasma chemical vapour deposited (PCVD) Ti-N-C films with different Cand N contents were examined, in comparison with C-free ones, by XPS, AES, XRD, SEMand microhardness testing. The PCVD Ti-N-C film may attribute its superior wear resist-ance to its high microhardness and dense structure. The variety of valence state of oxygenatoms adsorbed on Ti-N-C or TiN film surface was detected by AES and XPS analyses.Whether or not sufficient C atoms, existing in the lattice of the films seems to be decisive. Dif-ferent states of oxygen adsorbed may cause different modes of abrasive damage of film.

Key words: plasma chemical vapour deposition Ti-N-C film TiN film

Received: 18 January 1993

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https://www.ams.org.cn/EN/ OR https://www.ams.org.cn/EN/Y1993/V29/I1/87

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[2]	YU Li; LIU Jiwen;ZHAO Jie; DAI Shaoxia;JIN Zhujing;WANG Huijun(State Key Laboratory of Corroston and Protection;Institute of Corroston and Protection of Metals; Chinese Academy of Sciences;Shenyang;110015)( Metallurgical College; Mianjing Universily;Tianjin 300400 )(Manuscript received 1995-12-06; in revised form 1996-09-02). EFFECT OF SUBSTRATE TEMPERATURE ON THE PROPERTIES OF ION PLATING TiN FILMS[J]. 金属学报, 1996, 32(12): 1270-1274.
[3]	LIU Hanwei;CHEN Yuanru (Southwest Jiaotong University; Chengdu)ZHANG Xushou (Laboratory of Solid Lubrication; Lanzhou institute of Chemical Physics;Chinese Academy of Sciences; Lanzhou). TRIBOLOGICAL PROPERTIES OF TiN FILM BY ION BEAM ASSISTED DEPOSITION[J]. 金属学报, 1994, 30(19): 323-326.
[4]	LIU Changqing; LI Meishuan; JIN Zhujing; WU Weitao (Corrosion Science Lab.; Institute of Corrosion and Protection of Metals; Academia Sinica. Shenyang 110015). TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE[J]. 金属学报, 1992, 28(9): 91-94.
[5]	WANG Xi;YANG Genqing;LIU Xianghuai;ZHENG Zhihong;HUANG Wei;ZHOU Zuyao;ZOU Shichang Ion Beam Laboratory; Shanghai Institute of Metallurgy; Academia Sinica. PREPARATION OF TiN FILMS BY N_2 ASSISTED Xe~+ ION BEAM ENHANCED DEPOSITION AND THEIR MECHANICAL PROPERTIES[J]. 金属学报, 1992, 28(3): 87-91.
[6]	WANG Xi;ZHOU Jiankun;CHEN Youshan;LIU Xianghuai;ZOU Shichang Ion Beam Laboratory; Shanghai Institute of Metallurgy; Academia Sinica. COMPUTER SIMULATION OF ION BEAM ENHANCED DEPOSITION OF TiN FILMS[J]. 金属学报, 1991, 27(3): 136-141.
[7]	ZHOU Jiankun;LIU Xianghuai;CHEN Youshan;WANG Xi;ZHENG Zhihong;HUANG Wei;ZOU Shichang Shanghai Institute of Metallurgy. Academia Sinica Ion Beam Laboratory;Shanghai Institute of Metallurgy;Academia Sinica; Shanghai 200050. SYNTHESIS OF TiN FILM BY ION BEAM ENHANCED DEPOSITION AND ITS PROPERTIES[J]. 金属学报, 1990, 26(2): 136-141.
[8]	LI Shizhi;XU Xiang Qingdao Institute of Chemical Technology; Qingdao; ShandongProfessor;Thin Solid Films Lab.;Qingdao Institute of Chemical Technology;53 Zhengzhou Road; Qingdao; Shandong. PLASMA CHEMICAL VAPOR DEPOSITED TiN FILMS[J]. 金属学报, 1988, 24(3): 229-235.

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