TEM STUDY OF BONDING LAYERS IN DISSIMILAR ALLOY EXPLOSIVE BONDING JOINTS

Acta Metall Sin

1989, Vol. 25

Issue (1): 7-12 DOI:

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TEM STUDY OF BONDING LAYERS IN DISSIMILAR ALLOY EXPLOSIVE BONDING JOINTS

ZHOU Bangxin;SHENG Zhongqi;PENG Feng Southwest Center for Nuclear Reactor Engineering Research and Design

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ZHOU Bangxin;SHENG Zhongqi;PENG Feng Southwest Center for Nuclear Reactor Engineering Research and Design. TEM STUDY OF BONDING LAYERS IN DISSIMILAR ALLOY EXPLOSIVE BONDING JOINTS. Acta Metall Sin, 1989, 25(1): 7-12.

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Abstract The bonding layers in dissimilar alloy explosive bonding joints, γ/αstainless steels, copper/carbon steel and brass/γ-stainless steel have been studied bymeans of TEM technique. The results show that the bonding is obtained by diffu-sion and local melting at the contacted surface. The structure of bonding layer notonly responds to the compositions of the bonding alloys, but also the differencebetween their thermal conductivities, melting points and recrystallization tempera-tures. Because of the small molten region and fast cooling rate, the structure ofmolten region could be amorphous or microcrystals, and both stable and metastablephases exsist.

Key words: explosive bonding electron microscope bonding layer

Received: 18 January 1989

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https://www.ams.org.cn/EN/ OR https://www.ams.org.cn/EN/Y1989/V25/I1/7

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