金属学报  2006, Vol. 42 Issue (6): 647-652

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CBGA结构热循环条件下无铅焊点的显微组织和断裂

王薇;王中光; 冼爱平; 尚建库

中国科学院金属研究所沈阳材料科学国家联合实验室; 沈阳 110016

Microstructure and Fracture of Pb-free Solder Interconnects in Ceramic Ball Grid Array Packages under Thermal Cycling

WANG Wei; WANG Zhongguang; XIAN Aiping; SHANG Jianku

中国科学院金属所

王薇; 王中光; 冼爱平; 尚建库 . CBGA结构热循环条件下无铅焊点的显微组织和断裂[J]. 金属学报, 2006, 42(6): 647-652 .
, , , . Microstructure and Fracture of Pb-free Solder Interconnects in Ceramic Ball Grid Array Packages under Thermal Cycling[J]. Acta Metall Sin, 2006, 42(6): 647-652 .

摘要 参考文献 相关文章 Metrics 全文: PDF(551 KB)   摘要: 用热循环、扫描电镜观察焊点横截面和有限元模拟的方法研究了陶瓷球栅阵列（CBGA）封装结构中无铅焊点的组织和热疲劳行为。BGA结构的制备是通过Sn-3.0Ag-0.5Cu焊膏采用回流焊工艺把Sn-3.8Ag-0.7Cu焊球和镀银多层陶瓷芯片、镀铜印刷线路板(PCB)焊接在一起。回流焊后，在焊料与铜焊盘和银焊盘的界面处分别形成了Cu6Sn5和Ag3Sn金属间化合物(IMC)。在随后的热循环过程中，在铜焊盘处，Cu6Sn5层增厚，并且有新的化合物Cu3Sn出现；在陶瓷芯片一边，Ag3Sn层也增厚。焊球中靠近界面的Ag3Sn颗粒形态发生了从针状向球状过渡的变化。随着热循环周数的增加，焊点中出现疲劳裂纹。疲劳裂纹最先出现在芯片与焊球界面处焊球的边角位置上，从有限元模拟的结果得出此处具有最大的剪切应力。疲劳裂纹随后的生长导致了焊点的最终断裂。在印刷线路板处裂纹容易沿着Cu6Sn5和焊料的界面扩展，在陶瓷芯片处裂纹沿着靠近Ag3Sn界面层的焊球内部扩展。 关键词 ： 无铅焊料,  互连,  陶瓷球栅阵列封装     Abstract：Microstructure and thermal fatigue behavior of Pb-free solder interconnects in ceramic ball grid array (BGA) packages were examined by cross-sectional microscopy, thermal cycling experiments and finite element modeling. The BGA assemblies were made by reflow soldering Sn-Ag-Cu solder balls between Ag-metallized multilayer ceramic chip and Cu-metallized printed circuit board using the eutectic Sn-Ag-Cu solder paste. In the as-reflowed condition, Cu6Sn5 and Ag3Sn intermetallic compounds (IMCs) were formed at the solder interfaces with Cu and Ag metallizations respectively. Following thermal cycling, the Cu6Sn5 layer grew thicker and Cu3Sn IMC was found at the interface with Cu metallization. On the ceramic side, visible thickening of the Ag3Sn layer was also observed. The Ag3Sn in the solder near the interface went through a morphological change from the needle shape to spherical. As a result of repeated thermal cycling, fatigue cracks developed in the solder interconnects. The fatigue crack appeared first at the corner of the solder ball with the chip, where the maximum shear stress was found by the finite element analysis. Subsequent growth of the fatigue cracks led to final fracture of the solder interconnects. The cracks preferred to propagate along the Cu6Sn5/solder interface on the side of the print circuit board and in the solder joint near the interfacial Ag3Sn layer on the ceramic side. Key words： Pb-free solder    interconnect    ceramic ball grid array (CBGA) 收稿日期: 2005-11-01      ZTFLH:  TB302.3   服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 王薇 王中光 冼爱平 尚建库 44.8K 链接本文: https://www.ams.org.cn/CN/      或      https://www.ams.org.cn/CN/Y2006/V42/I6/647 [1] Xie D J, Wang Z P. Finite Elem Anal Design, 1998; 30: 31 [2] IPC (Association Connecting Electronics Industries). Moisture/Reflow Sensitivity Classification for Nonher-metic Solid State Surface Mount Devices. Joint Industry Standard, IPC/JEDEC J-STD-020C, 2004 [3] Sharif A, Islam M N, Chan Y C. Mater Sci Eng, 2004; B13: 84 [4] Allen S L, Notis M R, Chromik R R, Vinci R P. J Mater Res, 2004; 19: 1417 [5] Tu P L, Chan C, Hung C, Lai J K L. Microelectron Reliab, 2001; 41: 87 [6] Tu P L, Chan C, Hung C, Lai J K L. Microelectron Reliab, 2001; 41: 1993 [7] Xu X H. Master Thesis, National Cheng Kung University, Taibei, 2002 (许修豪．国立成功大学硕士学位论文,台北, 2002) [8] Ding Y, Wang C Q, Li M Y, Wang W Q. Mater Sci Eng, 2006; B127: 62 [9] Lin Y C, Chen X, Liu X S, Lu G Q. Microelectron Reliab, 2005; 45: 143 [10] Jen Y-M, Wu Y-L, Fang C-K. Microelectron Reliab, 2006; 46: 386 [11] Zhu X H, Yu Z X. Well-Chosen Example of ANSYS Senior Engineering Finite Element Analysis. Beijing: Publishing House of Electronics Industry, 2004: 313 (祝效华,余志祥． ANSYS高级工程有限元分析范例精选． 北京:电子工业出版社, 2004:313) [12] Wang G Z, Cheng Z N. Chin J Appl Mech, 2000; 17: 133 (王国忠,程兆年．应用力学学报, 2000;17:133) [13] Li Y, Wang R C, Gu Z G, Rong R F. J Fudan Univ (Nat Sci), 2003; 42: 60 (李 勇,汪荣昌,顾之光,戎瑞芬．复旦学报(自然科学版), 2003;42:60) [14] Qian Y Y, Ma X, Yoshida F. Weld J, 2002; 81: 85-s [1] 郭福, 杜逸晖, 籍晓亮, 王乙舒. 微电子互连用锡基合金及复合钎料热-机械可靠性研究进展[J]. 金属学报, 2023, 59(6): 744-756. [2] 张广平, 陈红蕾, 罗雪梅, 张滨. 微纳米尺度金属导电材料热疲劳研究进展[J]. 金属学报, 2018, 54(3): 357-366. [3] 邹建雄,刘波,林黎蔚,任丁,焦国华,鲁远甫,徐可为. MoC掺杂钌基合金无籽晶阻挡层微结构及热稳定性研究[J]. 金属学报, 2017, 53(1): 31-37. [4] 颜忠 冼爱平. 人工模拟海洋大气环境下Sn-0.7Cu无铅焊料的点蚀行为及微量Ga的影响[J]. 金属学报, 2011, 47(10): 1327-1334. [5] 田艳红 王春青 赵少伟. Cu焊盘TiN/Ag金属化层超声键合性能及抗氧化性能[J]. 金属学报, 2010, 46(5): 618-622. [6] 王小京 祝清省 王中光 尚建库. Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响[J]. 金属学报, 2009, 45(8): 912-918. [7] 张哲峰 张鹏 田艳中 张青科 屈伸 邹鹤飞 段启强 李守新 王中光. 金属材料疲劳损伤的界面效应[J]. 金属学报, 2009, 45(7): 788-800. [8] 尹立孟 杨艳 刘亮岐 张新平. 电子封装微互连焊点力学行为的尺寸效应[J]. 金属学报, 2009, 45(4): 422-427. [9] 刘波; 唐文进; 宋忠孝; 徐可为 . 铜互连多层膜系中自对准CuSiN层的微结构及其热稳定性[J]. 金属学报, 2007, 43(11): 1145-1147 . [10] 祝清省; 张黎; 王中光; 吴世丁; 尚建库 . 金属间化合物对Sn3.8Ag0.7Cu焊料合金拉伸性能的影响[J]. 金属学报, 2007, 42(1): 41-46 . [11] 张黎; 冼爱平; 王中光; 韩恩厚; 尚建库 . 应变速率对Sn--9Zn共晶合金拉伸性能的影响[J]. 金属学报, 2004, 40(11): 1151-1154 . Viewed Full text Abstract Cited   Shared      Discussed