Microstructures and Fatigue Damage of Submicron Thick Copper Films
ZHANG Bin; SUN Kaihong; LIU Yongdong;ZHANG Guangping
School of Materials & Metallurgy ; Northeastern University; Shenyang 110004
Cite this article:
ZHANG Bin; SUN Kaihong; LIU Yongdong; ZHANG Guangping. Microstructures and Fatigue Damage of Submicron Thick Copper Films. Acta Metall Sin, 2006, 42(1): 1-5 .