Microstructures and Fatigue Damage of Submicron Thick Copper Films

Acta Metall Sin

2006, Vol. 42

Issue (1): 1-5 DOI:

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Microstructures and Fatigue Damage of Submicron Thick Copper Films

ZHANG Bin; SUN Kaihong; LIU Yongdong;ZHANG Guangping

School of Materials & Metallurgy ; Northeastern University; Shenyang 110004

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ZHANG Bin; SUN Kaihong; LIU Yongdong; ZHANG Guangping. Microstructures and Fatigue Damage of Submicron Thick Copper Films. Acta Metall Sin, 2006, 42(1): 1-5 .

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Received: 11 May 2005

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