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| ROLE OF MULTI-ARC PLATED Ti-N FILM AS A DIFFUSION BARRIER |
| WANG Jiajun(Tsinghua University; Beijing);YE Ruizeng(University of Science and Technology Beijing);SUN Yufang(General Research institute for Nonferrous Metals;Beijing)(Manuscript received 27 July;1993;in revised form 6 September 1993) |
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Cite this article:
WANG Jiajun(Tsinghua University; Beijing);YE Ruizeng(University of Science and Technology Beijing);SUN Yufang(General Research institute for Nonferrous Metals;Beijing)(Manuscript received 27 July;1993;in revised form 6 September 1993). ROLE OF MULTI-ARC PLATED Ti-N FILM AS A DIFFUSION BARRIER. Acta Metall Sin, 1994, 30(14): 77-81.
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Abstract Several multi-layer coatings have been designed so as to assess the diffusion barriering ability against Al,Ni,Co,etc.as well as the high temperature stability of the multi-arc plated Ti-N film after being aged at 1000 and 1100℃ for a long time.The results show that,up to 1000℃,Ti-N film is of good stability;it can prevent effectively Al from diffusing towards matrix,and slow down the rate of diffusion of Ni,Co from CoCrAlTaY to matrix.Above 1100℃,the morphology of Ti-N film changes from thin foil to particles.Apparently the particle-shaped Ti-N can not prevent Ni,Co from the inter-diffusing between matrix and CoCrAlTaY coating.
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