STUDY OF NOVEL ELECTRONIC PACKAGING MATERIAL 70%Si-Al PREPARED BY THE SPRAY DEPOSITION

Acta Metall Sin

2005, Vol. 41

Issue (12): 1277-1279 DOI:

Research Articles

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STUDY OF NOVEL ELECTRONIC PACKAGING MATERIAL 70%Si-Al PREPARED BY THE SPRAY DEPOSITION

WANG Xiaofeng; ZHAO Jiuzhou; TIAN Chong

Institute of Metal Research; The Chinese Academy Sciences; Shenyang 110016

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WANG Xiaofeng; ZHAO Jiuzhou; TIAN Chong. STUDY OF NOVEL ELECTRONIC PACKAGING MATERIAL 70%Si-Al PREPARED BY THE SPRAY DEPOSITION. Acta Metall Sin, 2005, 41(12): 1277-1279 .

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Abstract 70%Si-Al alloy as a novel electronics package material was prepared by spray deposition. HIP technique was adopted in order to density the billet. The prepared 70%Si-Al alloy has a microstructure with fine silicon particles (10-20 μm in diameter) well dispersed in the matrix. The alloy shows excellent comprehensive properties, especially a lower thermal expansion coefficient and a lower density compared with the traditional electronics packaging materials. After HIP, The comprehensive properties of the 70%Si-Al alloy can be further enhanced. The alloy can be machined with the traditional cutting tools and applied as the packaging materials for the power IC, microwave electronic parts and integrate circuit blocks.

Key words: 70%Si-Al alloy electronics package material spray deposition

Received: 31 May 2005

ZTFLH:

TG132.11

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https://www.ams.org.cn/EN/ OR https://www.ams.org.cn/EN/Y2005/V41/I12/1277

[1] White D, Keck S, Smith I. Hybrid Circuits Technol, 1990; 12: 14
[2] Moores K A, Joshi Y K. Future Circuits Int, 2001; 7: 45
[3] Warren H, Hunt W H, Prekumar M K. J Met, 1992; 44: 8
[4] Bocking C, Jacobson D,Bennett G. Trans Inst Met Finish, 2002; 78: 243
[5] Ibrahim I A, Mohamed F A, Lavernia E J. J Mater Sci, 1991; 26: 1137
[6] Rennie A E W, Bocking C E, Bennett G R. J Mater Process Technol, 2001; 110: 186
[7] Jacobson D M, Sangha S P S. IEEE Trans Compon Packag Manufac Technol, 1998; 21A: 515
[8] Leatham A. Mater World, 1996; 4: 317
[9] Zhang Y A, Liu H W, Zhu B H. Chin J Nonferrous Met, 2004; 14(1): 23
[10] Jacobson D M, Sangha S P S. Future Microelectron Int, 1998; 15: 17
[11] Sangha S P S, Jacobson D M, Ogilvy A J W. J Eng Sci Educ, 1997; 11: 195
[12] Jacobson D M. Powder Metall, 2000; 43: 200
[13] Baffett J. Microelectron Reliab, 1998; 38: 1277u

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