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Cu/Sn/Cu超声-TLP接头的显微组织与力学性能 |
刘积厚1,2,赵洪运1,2,李卓霖2( ),宋晓国1,2,董红杰1,2,赵一璇1,2,冯吉才1,2 |
1哈尔滨工业大学先进焊接与连接国家重点实验室 哈尔滨 150001 2哈尔滨工业大学(威海)山东省特种焊接技术重点实验室 威海 264209 |
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Microstructures and Mechanical Properties of Cu/Sn/Cu Structure Ultrasonic-TLP Joint |
Jihou LIU1,2,Hongyun ZHAO1,2,Zhuolin LI2( ),Xiaoguo SONG1,2,Hongjie DONG1,2,Yixuan ZHAO1,2,Jicai FENG1,2 |
1 State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China2 Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China 2 Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China |
引用本文:
刘积厚,赵洪运,李卓霖,宋晓国,董红杰,赵一璇,冯吉才. Cu/Sn/Cu超声-TLP接头的显微组织与力学性能[J]. 金属学报, 2017, 53(2): 227-232.
Jihou LIU,
Hongyun ZHAO,
Zhuolin LI,
Xiaoguo SONG,
Hongjie DONG,
Yixuan ZHAO,
Jicai FENG.
Microstructures and Mechanical Properties of Cu/Sn/Cu Structure Ultrasonic-TLP Joint[J]. Acta Metall Sin, 2017, 53(2): 227-232.
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