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Cu:Cu-Al扩散偶淬火冷却过程中的“界面逆向迁移效应” |
吕忆城;M.R.Notis;J.I.Goldstein |
上海交通大学;美国Lehigh大学;美国Lehigh大学 |
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“INTERFACE WITHDRAWAL EFFECTS”AT TWOPHASE INTERFACES OF Cu:Cu-Al DIFFUSION COUPLES DURING QUENCHING |
Lü Yicheng(Y.C.Lu)Shanghai Jiaotong University;NOTIS;M.R.;GOLDSTEIN;J.I.Lehigh University.U.S.A. |
引用本文:
吕忆城;M.R.Notis;J.I.Goldstein. Cu:Cu-Al扩散偶淬火冷却过程中的“界面逆向迁移效应”[J]. 金属学报, 1985, 21(5): 67-148.
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“INTERFACE WITHDRAWAL EFFECTS”AT TWOPHASE INTERFACES OF Cu:Cu-Al DIFFUSION COUPLES DURING QUENCHING[J]. Acta Metall Sin, 1985, 21(5): 67-148.
1 吕忆城;Notis,M.R.;Goldstein,J.I.,金属学报,21(1985) . 2 Willey,L.A.,Bull.Alloy Phase Diagr.,1(1980) ,№1, 27. 3 Tanzilli,R.A.;Heckel,R.W.,Trans.Metall.Soc.AIME,242(1968) ,2313. 4 Oikawa,H.;Obara,T.;Karashima,S.,Metall.Trans.,1(1970) ,2969. 5 #12 |
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