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| Mo粉表面化学镀Cu及其反应机理 |
| 王光君; 王德志; 周杰; 吴壮志; 徐兵 |
1. 中南大学有色金属材料科学与工程教育部重点实验室; 长沙 410083
2. 中南大学 材料科学与工程学院; 长沙 410083 |
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| ELECTROLESS PLATING Cu ON Mo POWDER AND ITS REACTION MECHANISM |
| WANG Guangjun; WANG Dezhi; ZHOU Jie; WU Zhuangzhi; XU Bing |
1. Key Laboratory of Nonferrous Metal Materials Science and Engineering; Ministry of Education; Central South University; Changsha 410083
2. School of Materials Science and Engineering; Central South University; Changsha 410083 |
引用本文:
王光君 王德志 周 杰 吴壮志 徐兵. Mo粉表面化学镀Cu及其反应机理[J]. 金属学报, 2009, 45(4): 405-409.
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ELECTROLESS PLATING Cu ON Mo POWDER AND ITS REACTION MECHANISM[J]. Acta Metall Sin, 2009, 45(4): 405-409.
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