金属学报  2006, Vol. 42 Issue (2): 205-210

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老化对Sn-Ag-Cu焊料/Ni-P镀层界面结构和剪切强度的影响

唐兴勇;王珺;谷博;俞宏坤;肖斐

复旦大学材料科学系

Effects of Aging on Structures and Shear Strength of Interface of Sn-Ag-Cu Solder/Ni--P Plating Layer

Tang Xingyong

复旦大学材料科学系

唐兴勇; 王珺; 谷博; 俞宏坤; 肖斐 . 老化对Sn-Ag-Cu焊料/Ni-P镀层界面结构和剪切强度的影响[J]. 金属学报, 2006, 42(2): 205-210 .
, , , , . Effects of Aging on Structures and Shear Strength of Interface of Sn-Ag-Cu Solder/Ni--P Plating Layer[J]. Acta Metall Sin, 2006, 42(2): 205-210 .

摘要 参考文献 相关文章 Metrics 全文: PDF(887 KB)   摘要: 对Sn-3.5Ag-0.7Cu/Ni-P界面上的焊点进行了150℃固相老化和250℃液相回流老化实验. 两种条件下焊料体内和界面处金属间化合物的成分、长大速率及形貌均有较大差异. 在液相回流条件下金属间化合物长大更快, 对焊点的可靠性有较大的影响. 延长固相老化时间, 焊点内生成大尺寸的Ag3Sn相; 高温液相回流有Ni3P层生成, 降低焊点的焊接强度. 关键词 ： Sn-Ag-Cu焊料,  Ni-P镀层,  高温老化     Abstract：Intermetallic compounds (IMC) near the interfaces of solder joints has significant effects on joint reliability. In this paper, 150 oC aging and high temperature reflow of Sn-3.5Ag-0.7Cu solder joints on Ni-P/Cu were performed. For two aging processes, the IMC growth, morphologies, compositions and their effect on joint reliability were studied. The results indicate that the IMC morphologies and compositions in condition of 150 oC aging were much different from that in condition of reflow. Long time 150 oC aging results in large clusters of Ag3Sn IMC in solder. Brittle Ni3P layer was found after high temperature reflow, which was absent in long time 150 oC aging.. Under both conditions, ternary Ni-Cu-Sn IMCs were observed between solder interfaces. The morphologies, compositions and thickness of IMC affected the strength of solder joints. Key words： Lead-free solder    Ni-P    Thermal aging    Intermetallic compound 收稿日期: 2005-05-10      ZTFLH:  TG425.1   服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 唐兴勇 王珺 谷博 俞宏坤 肖斐 44.8K 链接本文: https://www.ams.org.cn/CN/      或      https://www.ams.org.cn/CN/Y2006/V42/I2/205 [1] Bath J, Handweker C, Bradley E. Circuits Assem, 2000; 11(5): 30 [2] Moon K W, Boettinger W J, Kattner U R. J Electron Mater, 2000; 29: 1122 [3] Tu K N, Zeng K. Mater Sci Eng, 2001; R34: 1 [4] Shawkret A, Du L G, Sun Z G, Sheng M, Luo L. Acta Metall Sin, 2001; 37: 439(肖克来提，杜黎光，孙志国，盛攻，罗乐．金属学报，2001；37：439) [5] He M, Chen Z, Qi G J. Ada Mater, 2004; 52: 2047 [6] Zeng K, Vuorinen V, Kivilahti J K. IEEE Trans Elec Pack Manuf Technol, 2002; 25: 162 [7] Won K C, Sung K K, Yoon C S. Proc 53rd Conf on Electronic Components and Technology. New York: IEEE Press, 2003: 1190 [8] Olivier F, Jean C, Jean-Francois S. Composites, 2002; 33A: 1391 [9] Zeng K, Tu K N. Mater Sci Eng, 2002; R38: 55 [10] Ho C E, Tsai R Y, Lin Y L. J Electron Mater, 2002; 31: 584 [11] Sharif A, Islam M N, Chan Y C. Mater Sci Eng, 2004; B113: 184 [12] Kim K S, Huh S H, Suganuma K. Microelectron Reliab, 2003; 43: 259 [13] Pang J H L, Low T H, Xiong B S. Thin Solid Films, 2004; 462-463: 370 [14] Tu K N, Gusak A M, Li M. J Appl Phys, 2003; 93: 1335 [15] Jang J W, Kim PG,Tu K N. J Appl Phys, 1999; 85: 8456k [1] 曹丽华, 陈胤伯, 史起源, 远杰, 刘志权. 合金元素对中温Sn-Ag-Cu焊料互连组织及剪切强度的影响[J]. 金属学报, 2019, 55(12): 1606-1614. [2] 杭春进,田艳红,赵鑫,王春青. 混装BGA器件高温老化实验焊点微观组织研究[J]. 金属学报, 2013, 49(7): 831-837. [3] 李志明 钱士强 王伟 刘继华. 热处理温度对电刷镀Ni-P镀层组织的影响[J]. 金属学报, 2010, 46(7): 867-872. [4] 周庆军; 何健英; 郝小鹏; 乔利杰; 李金许; 褚武扬 . 非晶Ni-P合金镀层压痕塑性变形及氢对塑性变形的影响[J]. 金属学报, 2007, 42(1): 87-90 . Viewed Full text Abstract Cited   Shared      Discussed