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| 熔渗-焊接法制备了W／Cu功能梯度材料的研究 |
| 周张健 葛昌纯 |
| 北京科技大学无机材料特种陶瓷中心; 北京 100083 |
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引用本文:
周张健; 葛昌纯 . 熔渗-焊接法制备了W／Cu功能梯度材料的研究[J]. 金属学报, 2000, 36(6): 655-658 .
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