|
|
用于微机械器件在Fe-Ni合金电镀沉积膜的性能 |
陈垚 张轩雄 |
中国科学院上海冶金研究所; 上海 200050 |
|
引用本文:
陈垚; 张轩雄 . 用于微机械器件在Fe-Ni合金电镀沉积膜的性能[J]. 金属学报, 2000, 36(5): 525-529 .
[1] Hirano T, Fan L S, Gao J Q, Lee W Y. J MEMS,1998;7:149 [2] Toshiki H,Fan L S.SPIE Proc, 1996; 2879:252 [3] Chen Y,Wang W Y.J Funct Mater Devices, 1999; 5: 147(陈 ,王渭源.功能材料与器件学报,1999;5:147) [4] Xiong X G, Zhou Q, Lu D R, Wang W Y. SPIE Procee,1997; 3223: 294 [5] Stoney G G. Proc Roy Soc, 1921; A82: 172 [6] Guo C L, Guo R F, Huang Y H. Chin Sci Bull, 1996;41(9): 851(郭常霖,郭荣发,黄月鸿.科学通报,1996;41(9):851) [7] Kurl H. Stress Wave in Solid. Beijing: Science Press,1958: 122(考尔斯基H.固体中的应力波.北京:科学出版社,1958:122) [8] Grimmett D L, Schwartz M, Nobe K. J Electrochem Soc,1993; 140: 977 [9] Group of"Hardbook of Expansion Alloys". Handbookof Expansion Alloys.Beijing:Metallurgy Industry Press,1979: 19(膨胀合金手册编写组.膨胀合金手册.北京:冶金工业出版社,1979:19) [10] Grimmett D L,Schwarts M, Nobe K. J Electrochem Soc,1993; 140(4): 973 [11] Weast R C. Handbook of Chemistry and Physics. 59th ed,D193, CRC Press, 1978: 564 [12] Pelosin V, Badawi K F, Branger V. Appl Phys Lett, 1995;66(6): 691 [13] Henstock M E, Spencer-Timms E S. Trans Inst Met Finish, 1963; 40: 179 [14] Czerwinski F. Thin Solid Film, 1996; 280: 202 [15] Safranek W H. The Poverties of Electrodeposited Metalsand Alloys. 2nd ed, Orlando, Florida, American Electro-platers and Surface Finishers Society, 1986: 211 [16] Tilmans Harrie A C. Elwenspoek M, Fluitman Jan H J.Sens Actuators, 1992; A30: 35 |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|