金属学报  1983, Vol. 19 Issue (6): 92-99

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Cu-Ti合金与金刚石(或石墨)界面微区组织的分析研究

高巧君

北京大学物理系

STRUCTURE MICROANALYSIS OF INTERFACE BETWEEN Cu-Ti ALLOY AND DIAMOND (OR GRAPHITE)

GAO Qiaojun (Department of Physics; Peking University)

高巧君. Cu-Ti合金与金刚石(或石墨)界面微区组织的分析研究[J]. 金属学报, 1983, 19(6): 92-99.
. STRUCTURE MICROANALYSIS OF INTERFACE BETWEEN Cu-Ti ALLOY AND DIAMOND (OR GRAPHITE)[J]. Acta Metall Sin, 1983, 19(6): 92-99.

摘要 参考文献 相关文章 Metrics 全文: PDF(2188 KB)   摘要: 本文利用扫描电镜X射线能谱及X射线光谱分析,结合金相及试样逐层的X射线结构分析,剖析了Cu-Ti合金与石墨(或金刚石)粘结界面的微区组织结构;揭示了Cu-Ti合金对金刚石表面的浸润和粘结机理。即Cu-Ti合金中的Ti原子与石墨(或金刚石)表面的碳原子在高温下反应生成稳定的断续的TiC膜,Cu-Ti合金对金刚石的浸润和粘结是通过TiC来实现的。 Abstract：The structure of micro-region along the interfacial section between Cu-Ti alloy and graphite (or diamond) has been analyzed by using SEM-EDS and SEMWDS as well as in-depth metallography and X-ray diffraction. It was revealed that the wetting and bonding behaviour on diamond surface by Cu-Ti melt is realized through the stable TiC film which is produced by interaction between Ti atoms of Cu-Ti alloy and C atoms of graphite (or diamond) surface at elevated temperatures. 收稿日期: 1983-06-18      服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 高巧君 44.8K 链接本文: https://www.ams.org.cn/CN/      或      https://www.ams.org.cn/CN/Y1983/V19/I6/92 1 Mortimer, D. A.; Nicholas, M., J. Mater. Sci., 5 (1970) , 149． 2 Mortimer, D. A.; Nicholas, M., ibid., 8 (1973) , 640． 3 Scott, P. M.; Nicholas, M., ibid., 10 (1975) , 1833． 4 Standing, R.; Nicholas, M., ibid., 13 (1978) , 1509． 5 Kizikov, E. D., Met. Sci. Heat Treat., 17 (1975) , 61． 6 林增栋;徐乍英,未公开发表资料,1979． 7 林增栋;未公开发表资料. 8 林增栋;徐乍英;杨伟光,未公开发表资料,1981． 9 Joukainen, A.; Grant, N. J.; Floe, C. F., Trans. AIME,, 194 (1952) , 766． No related articles found! Viewed Full text Abstract Cited   Shared      Discussed