Breaking the Trade-Off Relation Between Strength and Electrical Conductivity: Heterogeneous Grain Design
Received date: 2022-05-07
Revised date: 2022-06-13
Online published: 2022-07-11
Supported by
National Natural Science Foundation of China(52001313);China Postdoctoral Science Foundation(2019M661151)
The trade-off relationship between the strength and the electrical conductivity has been the bottleneck restricting the development of conductive metallic materials with high strength and high electrical conductivity. In this study, commercially pure Al wires and commercially pure Cu wires with various grain characteristics were prepared by the cold-drawing process to investigate the influencing mechanisms of grain on strength and electrical conductivity. Surprisingly, the synchronous increase in strength and electrical conductivity may be achieved both for the commercially pure Al wires and commercially pure Cu wires in the later stage of cold-drawing deformation, which shatters the traditional constrictive relationship between the strength and the electrical conductivity. Additionally, the microstructure investigation demonstrates that with the increase of drawing deformation, the axial grains were lengthened, the radial grains were increasingly polished, and the radial <001> texture was transformed to <111> texture. Finally, the heterogeneous microstructures, including heterogeneous grain formation and heterogeneous crystal orientation were formed. The theoretical analysis reveals that the grain width and texture mainly influence the strength, and the grain length primarily influences the electrical conductivity. Consequently, the axial long grain, the radial fine grain, and radial hard orientation texture are proved to be the primary mechanisms causing the synchronous improvement of strength and electrical conductivity of commercially pure Al wires and commercially pure Cu wires. This suggests that the heterogeneous grain design may be considered a useful method to create conductive metallic materials with high strength and high electrical conductivity.
Jiapeng HOU , Pengfei SUN , Qiang WANG , Zhenjun ZHANG , Zhefeng ZHANG . Breaking the Trade-Off Relation Between Strength and Electrical Conductivity: Heterogeneous Grain Design[J]. Acta Metall Sin, 2022 , 58(11) : 1467 -1477 . DOI: 10.11900/0412.1961.2022.00222
| 1 | Hou J P, Wang Q, Yang H J, et al. Microstructure evolution and strengthening mechanisms of cold-drawn commercially pure aluminum wire [J]. Mater. Sci. Eng., 2015, A639: 103 |
| 2 | Guan R G, Shen Y F, Zhao Z Y, et al. A high-strength, ductile Al-0.35Sc-0.2Zr alloy with good electrical conductivity strengthened by coherent nanosized-precipitates [J]. J. Mater. Sci. Technol., 2017, 33: 215 |
| 3 | Liu L, Jiang J T, Zhang B, et al. Enhancement of strength and electrical conductivity for a dilute Al-Sc-Zr alloy via heat treatments and cold drawing [J]. J. Mater. Sci. Technol., 2019, 35: 962 |
| 4 | Yuan W H, Liang Z Y, Zhang C Y, et al. Effects of La addition on the mechanical properties and thermal-resistant properties of Al-Mg-Si-Zr alloys based on AA 6201 [J]. Mater. Des., 2012, 34: 788 |
| 5 | Li Y P, Xiao Z, Li Z, et al. Microstructure and properties of a novel Cu-Mg-Ca alloy with high strength and high electrical conductivity [J]. J. Alloys Compd., 2017, 723: 1162 |
| 6 | Ren J Q, Liang S H, Jiang Y H, et al. Research on the microstructure and properties of in situ (TiB2-TiB)/Cu composites [J]. Acta Metall. Sin., 2019, 55: 126 |
| 6 | 任建强, 梁淑华, 姜伊辉 等. 原位(TiB2-TiB)/Cu复合材料组织与性能研究 [J]. 金属学报, 2019, 55: 126 |
| 7 | Liu Y G, Zhang J Q, Tan Q Y, et al. Additive manufacturing of high strength copper alloy with heterogeneous grain structure through laser powder bed fusion [J]. Acta Mater., 2021, 220: 117311 |
| 8 | Li R G, Guo E Y, Chen Z N, et al. Optimization of the balance between high strength and high electrical conductivity in CuCrZr alloys through two-step cryorolling and aging [J]. J. Alloys Compd., 2019, 771: 1044 |
| 9 | Fu Q Q, Li B, Gao M Q, et al. Quantitative mechanisms behind the high strength and electrical conductivity of Cu-Te alloy manufactured by continuous extrusion [J]. J. Mater. Sci. Technol., 2022, 121: 9 |
| 10 | Karabay S. Modification of AA-6201 alloy for manufacturing of high conductivity and extra high conductivity wires with property of high tensile stress after artificial aging heat treatment for all-aluminium alloy conductors [J]. Mater. Des., 2006, 27: 821 |
| 11 | Rhee H, Whittington W R, Oppedal A L, et al. Mechanical properties of novel aluminum metal matrix metallic composites: Application to overhead conductors [J]. Mater. Des., 2015, 88: 16 |
| 12 | Cabibbo M. Microstructure strengthening mechanisms in different equal channel angular pressed aluminum alloys [J]. Mater. Sci. Eng., 2013, A560: 413 |
| 13 | Ding S X, Lee W T, Chang C P, et al. Improvement of strength of magnesium alloy processed by equal channel angular extrusion [J]. Scr. Mater., 2008, 59: 1006 |
| 14 | Kim W J, Wang J Y. Microstructure of the post-ECAP aging processed 6061 Al alloys [J]. Mater. Sci. Eng., 2007, A464: 23 |
| 15 | Ito Y, Horita Z. Microstructural evolution in pure aluminum processed by high-pressure torsion [J]. Mater. Sci. Eng., 2009, A503: 32 |
| 16 | Kamikawa N, Huang X X, Tsuji N, et al. Strengthening mechanisms in nanostructured high-purity aluminium deformed to high strain and annealed [J]. Acta Mater., 2009, 57: 4198 |
| 17 | Saito Y, Utsunomiya H, Tsuji N, et al. Novel ultra-high straining process for bulk materials-development of the accumulative roll-bonding (ARB) process [J]. Acta Mater., 1999, 47: 579 |
| 18 | Feng T L, Qiu B, Ruan X L. Coupling between phonon-phonon and phonon-impurity scattering: A critical revisit of the spectral Matthiessen's rule [J]. Phys. Rev., 2015, 92B: 235206 |
| 19 | Botcharova E, Freudenberger J, Schultz L. Mechanical and electrical properties of mechanically alloyed nanocrystalline Cu-Nb alloys [J]. Acta Mater., 2006, 54: 3333 |
| 20 | Murashkin M Y, Sabirov I, Sauvage X, et al. Nanostructured Al and Cu alloys with superior strength and electrical conductivity [J]. J. Mater. Sci., 2016, 51: 33 |
| 21 | Sabirov I, Murashkin M Y, Valiev R Z. Nanostructured aluminium alloys produced by severe plastic deformation: New horizons in development [J]. Mater. Sci. Eng., 2013, A560: 1 |
| 22 | Valiev R Z, Murashkin M Y, Sabirov I. A nanostructural design to produce high-strength Al alloys with enhanced electrical conductivity [J]. Scr. Mater., 2014, 76: 13 |
| 23 | Murashkin M Y, Sabirov I, Medvedev A E, et al. Mechanical and electrical properties of an ultrafine grained Al-8.5wt.% RE (RE = 5.4wt.% Ce, 3.1wt.% La) alloy processed by severe plastic deformation [J]. Mater. Des., 2016, 90: 433 |
| 24 | Murashkin M Y, Sabirov I, Kazykhanov V U, et al. Enhanced mechanical properties and electrical conductivity in ultrafine-grained Al alloy processed via ECAP-PC [J]. J. Mater. Sci., 2013, 48: 4501 |
| 25 | Zhu C C, Ma A B, Jiang J H, et al. Effect of ECAP combined cold working on mechanical properties and electrical conductivity of Conform-produced Cu-Mg alloys [J]. J. Alloys Compd., 2014, 582: 135 |
| 26 | Karabay S, Uzman I. Inoculation of transition elements by addition of AlB2 and AlB12 to decrease detrimental effect on the conductivity of 99.6% aluminium in CCL for manufacturing of conductor [J]. J. Mater. Process. Technol., 2005, 160: 174 |
| 27 | Li P F, Wu Z G, Wang Y L, et al. Effect of cerium on mechanical performance and electrical conductivity of aluminum rod for electrical purpose [J]. J. Rare Earths, 2006, 24: 355 |
| 28 | Cui X L, Wu Y Y, Liu X F, et al. Effects of grain refinement and boron treatment on electrical conductivity and mechanical properties of AA1070 aluminum [J]. Mater. Des., 2015, 86: 397 |
| 29 | Liao H C, Liu Y, Lü C L, et al. Effect of Ce addition on castability, mechanical properties and electric conductivity of Al-0.3Si-0.2Mg alloy [J]. Int. J. Cast. Met. Res., 2015, 28: 213 |
| 30 | Xie M, Liu J L, Lu X Y, et al. Investigation on the Cu-Cr-RE alloys by rapid solidification [J]. Mater. Sci. Eng., 2001, A304-306: 529 |
| 31 | Hou J P, Li R, Wang Q, et al. Three principles for preparing Al wire with high strength and high electrical conductivity [J]. J. Mater. Sci. Technol., 2019, 35: 742 |
| 32 | Hou J P, Wang Q, Zhang Z J, et al. Nano-scale precipitates: The key to high strength and high conductivity in Al alloy wire [J]. Mater. Des., 2017, 132: 148 |
| 33 | Li J Z, Ding H, Li B M, et al. Microstructure evolution and properties of a Cu-Cr-Zr alloy with high strength and high conductivity [J]. Mater. Sci. Eng., 2021, A819: 141464 |
| 34 | Wang Y P, Fu R D, Li Y J, et al. A high strength and high electrical conductivity Cu-Cr-Zr alloy fabricated by cryogenic friction stir processing and subsequent annealing treatment [J]. Mater. Sci. Eng., 2019, A755: 166 |
| 35 | Ye Y X, Yang X Y, Wang J, et al. Enhanced strength and electrical conductivity of Cu-Zr-B alloy by double deformation-aging process [J]. J. Alloys Compd., 2014, 615: 249 |
| 36 | Carlton C E, Ferreira P J. What is behind the inverse Hall-Petch effect in nanocrystalline materials? [J]. Acta Mater., 2007, 55: 3749 |
| 37 | Hall E O. The deformation and ageing of mild steel: III Discussion of results [J]. Proc. Phys. Soc., 1951, 64B: 747 |
| 38 | Wyrzykowski J W, Grabski M W. The Hall-Petch relation in aluminium and its dependence on the grain boundary structure [J]. Philos. Mag., 1986, 53A: 505 |
| 39 | Miyajima Y, Komatsu S Y, Mitsuhara M, et al. Change in electrical resistivity of commercial purity aluminium severely plastic deformed [J]. Philos. Mag., 2010, 90: 4475 |
| 40 | Ritchie R O. The conflicts between strength and toughness [J]. Nat. Mater., 2011, 10: 817 |
| 41 | Wang H W, He Z F, Jia N. Microstructure and mechanical properties of a FeMnCoCr high-entropy alloy with heterogeneous structure [J]. Acta Metall. Sin., 2021, 57: 632 |
| 41 | 王洪伟, 何竹风, 贾 楠. 非均匀组织FeMnCoCr高熵合金的微观结构和力学性能 [J]. 金属学报, 2021, 57: 632 |
| 42 | Wu X L, Zhu Y T. Heterogeneous materials: A new class of materials with unprecedented mechanical properties [J]. Mater. Res. Lett., 2017, 5: 527 |
| 43 | Zhu Y T, Wu X L. Perspective on hetero-deformation induced (HDI) hardening and back stress [J]. Mater. Res. Lett., 2019, 7: 393 |
| 44 | An X H, Wu S D, Wang Z G, et al. Enhanced cyclic deformation responses of ultrafine-grained Cu and nanocrystalline Cu-Al alloys [J]. Acta Mater., 2014, 74: 200 |
| 45 | Li P, Li S X, Wang Z G, et al. Fundamental factors on formation mechanism of dislocation arrangements in cyclically deformed fcc single crystals [J]. Prog. Mater. Sci., 2011, 56: 328 |
| 46 | Wang X F, Guo M X, Luo J R, et al. Effect of intermediate annealing time on microstructure, texture and mechanical properties of Al-Mg-Si-Cu alloy [J]. Mater. Charact., 2018, 142: 309 |
| 47 | Wang S C, Starink M J, Gao N, et al. Texture evolution by shear on two planes during ECAP of a high-strength aluminum alloy [J]. Acta Mater., 2008, 56: 3800 |
| 48 | Zhang J Y, Ma M Y, Shen F H, et al. Influence of deformation and annealing on electrical conductivity, mechanical properties and texture of Al-Mg-Si alloy cables [J]. Mater. Sci. Eng., 2018, A710: 27 |
| 49 | Hou J P, Chen Q Y, Wang Q, et al. Effects of annealing treatment on the microstructure evolution and the strength degradation behavior of the commercially pure Al conductor [J]. Mater. Sci. Eng., 2017, A707: 511 |
| 50 | Hou J P, Li R, Wang Q, et al. Breaking the trade-off relation of strength and electrical conductivity in pure Al wire by controlling texture and grain boundary [J]. J. Alloys Compd., 2018, 769: 96 |
| 51 | Parthasarathy T A, Rao S I, Dimiduk D M, et al. Contribution to size effect of yield strength from the stochastics of dislocation source lengths in finite samples [J]. Scr. Mater., 2007, 56: 313 |
| 52 | Beyerlein I J, Tóth L S. Texture evolution in equal-channel angular extrusion [J]. Prog. Mater. Sci., 2009, 54: 427 |
| 53 | Bailey J E, Hirsch P B. The dislocation distribution, flow stress, and stored energy in cold-worked polycrystalline silver [J]. Philos. Mag., 1960, 5: 485 |
| 54 | Hansen N, Huang X. Microstructure and flow stress of polycrystals and single crystals [J]. Acta Mater., 1998, 46: 1827 |
| 55 | Matthiessen A, Vogt A C C. On the influence of temperature on the electric conducting-power of alloys [J]. Philos. Trans., 1864, 154: 167 |
| 56 | Murata Y, Nakaya I, Morinaga M. Assessment of strain energy by measuring dislocation density in copper and aluminium prepared by ECAP and ARB [J]. Mater. Trans., 2008, 49: 20 |
| 57 | Miyajima Y, Mitsuhara M, Hata S, et al. Quantification of internal dislocation density using scanning transmission electron microscopy in ultrafine grained pure aluminium fabricated by severe plastic deformation [J]. Mater. Sci. Eng., 2010, A528: 776 |
| 58 | Zhang J W, Gao N, Starink M J. Microstructure development and hardening during high pressure torsion of commercially pure aluminium: Strain reversal experiments and a dislocation based model [J]. Mater. Sci. Eng., 2011, A528: 2581 |
| 59 | Sauvage X, Bobruk E V, Murashkin M Y, et al. Optimization of electrical conductivity and strength combination by structure design at the nanoscale in Al-Mg-Si alloys [J]. Acta Mater., 2015, 98: 355 |
/
| 〈 |
|
〉 |
