EFFECTS OF CURRENT DENSITY ON MICROSTRUCTURE OF W COATING ON V-4Cr-4Ti ALLOY BY ELECTRODEPOSITION

  • LI Xuliang ,
  • ZHANG Yingchun ,
  • JIANG Fan ,
  • WANG Lili ,
  • LIU Yanhong ,
  • SUN Ningbo
Expand
  • School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083

Received date: 2013-01-23

  Revised date: 2013-04-16

  Online published: 2013-06-11

Abstract

The W coatings prepared on structure materials (V-4Cr-4Ti) as plasma facing materials, not only can release impinging thermal power but also can resist erosion under plasma particles bombardment in international thermonuclear experimental reactor. The electro deposition of W in Na2WO4-WO3 melt as a promising technique was studied in this work. The effects of current density on microstructure and mechanical properties of W coating were investigated, and the results show that, with the increasing of the current density, the trend of crystal growth is promoted and the grain size of W coatings increased. The nucleation easily occurs on V-4Cr-4Ti alloy substrate for W atom, and after that, the growth of crystal nuclei is the most important factor for the formation of coatings. When the current density increases to 100 mA/cm2, the metallographic structure of W coatings presents columnar or stripy structure, and tooth-like grains were presented in microstructure as current density is lower. The Vickers micro-hardness of W coatings is decreased as increasing current density, and the adhesive strength of the coatings is greater than 59.36 MPa by the tensile test. Although the thickness of tungsten coatings is 10 μm as current density is 10 mA/cm2, grain size is less than 5 μm, Vickers hardness, current efficiency and the coatings adhesion are all maximum, and the values are 628.42 HV, 99.71% and 96 N respectively.

Cite this article

LI Xuliang , ZHANG Yingchun , JIANG Fan , WANG Lili , LIU Yanhong , SUN Ningbo . EFFECTS OF CURRENT DENSITY ON MICROSTRUCTURE OF W COATING ON V-4Cr-4Ti ALLOY BY ELECTRODEPOSITION[J]. Acta Metall Sin, 2013 , 49(6) : 745 -750 . DOI: 10.3724/SP.J.1037.2013.00042

References

[1] Ma R X, Zhou C H, Li G X.  Chin J Nonferrous Met, 2000; 10: 715

 (马瑞新, 周传华, 李国勋. 中国有色金属学报, 2000; 10: 715)
[2] Liu Y H, Zhang Y C, Ge C C.  Mater Sci Eng Powder Metall, 2011; 16: 315
 (刘艳红, 张迎春, 葛昌纯.粉末冶金材料科学与工程, 2011; 16: 315)
[3] Bolt H, Barabash V, Krauss W, Linke J, Neu R, Suzuki S, Yoshida N.  J Nucl Mater, 2002; 329-333: 66
[4] Xu Z Y.  Atom Energy Sci Technol, 2003; 37(suppl): 105
 (许增裕. 原子能科学与技术, 2003; 37(增刊): 105)
[5] Nishimura A, Iwahori A, Heo N J, Nagasaka T, Muroga T, Tanaka S I.  J Nucl Mater, 2004; 329-333: 438
[6] Senderoff S, Mellors G W.  Science, 1966; 153: 1475
[7] Katagiri A.  J Electrochem Soc, 1991; 38: 768
[8] Masuda M, Takenishi H, Katagiri A.  J Electrochem Soc, 2001; 148: 60
[9] Nakajima H, Nohira T, Hagiwara H, Nitta K, Inazawa S, Okada K.
 Electrochim Acta, 2007; 53: 25
[10] Wu Z D.  Acta Chemica Sin, 1990; 48: 895
 (吴仲达. 化学学报, 1990; 48: 895)
[11] Malyshev V V.  Protect Met, 2001; 37: 247
[12] Ma R X, Lin W, Wu Z L, Kang B, Wang M K.  Mater Sci Technol, 2009; 17: 754
 (马瑞新, 林炜, 吴中亮, 康勃, 王目孔.材料科学与工艺, 2009; 17: 754)
[13] Li Y G.  PhD Dissertation, Northeastern University, Shenyang, 2005
 (李运刚. 东北大学博士学位论文, 沈阳, 2005)
[14] Liu Y H, Zhang Y C, Liu Q Z.  Rare Met Mater Eng, 2011; 40: 436
 (刘艳红, 张迎春, 刘其宗. 稀有金属材料与工程, 2011; 40: 436)
[15] Liu Y H, Zhang Y C, Liu Q Z, Li X L, Jiang F.  Int J Refract Met Hard Mater, 2012; 35: 241
[16] Liu Y H, Zhang Y C, Liu Q Z, Li X L, Jiang F.  Fusion Eng Des, 2012; 87: 1861
[17] Zhang Q X, Zhao Q S.  Tungsten and Molybdenum Metallurgy.Beijing: Metallurgical Industry Press, 2005: 65
 (张启修, 赵秦生. 钨钼冶金. 北京: 冶金工业出版社, 2005: 65)
[18] Zhou S M.  Principle and Methodology for Electrodeposition.Shanghai: Shanghai Science and Technology Press, 1987: 124
 (周绍民. 金属电沉积-原理与研究方法. 上海: 上海科学技术出版社, 1987: 124)
[19] Budevski E, Staikov G, Lorenz W J.  Electrochem Acta, 2000; 45: 2559
[20] Hirai T, Pintsuk G, Linke J, Batilliot M.  J Nucl Mater, 2009; 390-391: 751
[21] Pintsuk G, Prokhodtseva A.  J Nucl Mater, 2011; 417: 483
[22] Koji N, Toshiyuki N, Rika H.  J Appl Electrochem, 2010; 40: 1443
[23] Yu Y N.  Principles of Metallography. Beijing: Metallurgical Industry Press, 2000: 275
 (余永宁. 金属学原理. 北京: 冶金工业出版社, 2000: 275)
[24] Chen F C, Xiao X, Zhou Q, He D L.  Contemporary Electroplating Technology.Beijing: China Textile & Apparell Press, 2009:46
 (陈范才, 肖鑫, 周琦, 何德良. 现代电镀技术. 北京: 中国纺织出版社, 2009: 46)
[25] Sethi R S.  J Appl Eletrochem, 1979; 9: 419
[26] Simka W, Puszczyk D, Nawrat G.  Electrochim Acta, 2009; 54: 5310
Outlines

/