Abstract A novel super cooled process for transient liquid phase (TLP) bonding is proposed, which is different from conventional TLP bonding in the following: the liquid interlayer is heated to a high temperature and held a few seconds, and then cooled to a low temperature and held a few minutes. Both two bonding temperatures are higher than the melting point of the interlayer. Owing to a fall of temperature, a super-cooling of composition is formed at the solid/liquid interface and the interfacial stabilities of the equilibrium solidification is broken, resulting in a cellular interface. After the completion of solidification, the interface disappears, and a seamless joint is produced. The experiment of the novel super cooled process is carried out using carbon steel as base metal and iron-nickel base amorphous alloy as interlayer, compared with that of conventional TLP bonding. A non-planar interface forms at the first stage and disappears at the finally stage during super cooled bonding, so a homogenous joint free of interface is produced. As the detrimental effect of interface on bond properties is avoided, the impact toughness of joint is improved by super cooled process, which reaches the base metal level.
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