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| Effects of Ambient and Cryogenic Rolling on {111}/{111} Near Singular Boundary Formation During Subsequent Recrystallization Annealing in Pure Aluminum |
LI Zhenxiang1, WANG Weiguo1,2( ), Rohrer Gregory S3, HONG Lihua1,2, CHEN Song1,2, LIN Yan1,2, ZHOU Bangxin4 |
1 Institute of Grain Boundary Engineering, Fujian University of Technology, Fuzhou 350118, China 2 School of Materials Science and Technology, Fujian University of Technology, Fuzhou 350118, China 3 Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA15213 -3890, USA 4 Institute of Materials, Shanghai University, Shanghai 200072, China |
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Cite this article:
LI Zhenxiang, WANG Weiguo, Rohrer Gregory S, HONG Lihua, CHEN Song, LIN Yan, ZHOU Bangxin. Effects of Ambient and Cryogenic Rolling on {111}/{111} Near Singular Boundary Formation During Subsequent Recrystallization Annealing in Pure Aluminum. Acta Metall Sin, 2025, 61(11): 1673-1688.
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Abstract Recent advancements in grain boundary engineering have revealed that the {111}/{111} near singular boundary (NSB) exhibits superior resistance to corrosion attacks than the random boundary in aluminum and its alloys. Thus, understanding the influential factors and formation mechanisms of the {111}/{111} NSB, as well as regulating such boundaries, is crucial for enhancing the resistance performance of aluminum and its alloys against intergranular corrosion attacks. To intrinsically comprehend the formation mechanism of the {111}/{111} NSB in aluminum alloys, this study used high purity aluminum (99.99%) as the experimental material. Initially, the starting samples were synthesized through multidirectional forging at room temperature (25 oC), followed by recrystallization annealing at 370 oC. The as-synthesized starting samples exhibited uniform microstructures with an average grain size of 20 μm and random grain orientations. Subsequently, two parallel starting samples were rolled at 25 oC and at the cryogenic temperature (-196 oC), respectively, with an 80% thickness reduction, followed by immediate recrystallization annealing at 370 oC for 30 min. Later, a quantitative grain boundary inter-connection characterization method based on EBSD and five parameter analysis was employed to statistically analyze the grain boundary character distributions within the samples. The results revealed that the cryo-rolled and recrystallized sample featured a higher proportion of the {111}/{111} NSB compared to the 25 oC-rolled and recrystallized sample. Specifically, the {111}/{111} NSB fraction in the former reached 6.0%, 2.22 times that in the latter. XRD analysis, hardness testing, and EBSD measurements revealed the development of a strong {011}<> deformation texture in the samples rolled at 25 oC or the cryogenic temperature. In particular, cryo-rolling was found to impede dynamic recovery; hence, the sample rolled at this temperature featured higher levels of residual compression stress, increased grain fragmentation, and higher stored energy compared to the sample rolled at 25 oC. Owing to the higher driving force and more active {011}<>-oriented growth, the cryo-rolled sample formed larger grains and stronger {011}<> recrystallization textures during the subsequent recrystallization annealing. Statistical analysis based on grain boundary tracing demonstrated that the grain boundaries between {011}<>-oriented grains and other oriented grains contained higher proportions of the {111}/{111} NSB compared to the grain boundaries between two randomly oriented grains. Moreover, boundaries between the {011}<>- oriented grains and their diffusive orientations featured notably high proportions of the {111}/{111} NSB. This explains the higher content of the {111}/{111} NSB observed in the cryo-rolled and recrystallized sample than that in the 25 oC-rolled and recrystallized sample.
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Received: 30 January 2024
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| Fund: National Natural Science Foundation of China(51971063);Natural Science Foundation of Fujian Province(2021J011076) |
Corresponding Authors:
WANG Weiguo, professor, Tel: (0591)22863515, E-mail: wang_weiguo@vip.163.com
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