Please wait a minute...
Acta Metall Sin  2004, Vol. 40 Issue (2): 173-178     DOI:
Research Articles Current Issue | Archive | Adv Search |
Chemical Plating Nickel on the Surface of Hexagonal Boron Nitride Micro-Particles and Its Kinetic Model
LI Fan; ZHANG Dengjun; LI Baohou; LUO Shimin
Institute of Process Engineering; The Chinese Academy of Sciences; Beijing 100080
Cite this article: 

LI Fan; ZHANG Dengjun; LI Baohou; LUO Shimin. Chemical Plating Nickel on the Surface of Hexagonal Boron Nitride Micro-Particles and Its Kinetic Model. Acta Metall Sin, 2004, 40(2): 173-178 .

Download:  PDF(5624KB) 
Export:  BibTeX | EndNote (RIS)      
Abstract  The kinetic investigation of hydrazine reduction chemical plating nickel on the surface of hexagonal boron nitride with the average diameter 104 μm particles has been carried out. A model, extension-contraction autocatalysis reaction interface, was created which can demonstrate the curves of deposited nickel with time. Based on the model a kinetic expression for the chemical planting process has been derived, and with the expression the experimental kinetic curves could be fitted, experiments verified the model being suitable. SEM morphologies and EDS analysis of the deposited nickel on the BN surface for different times also supported the model.
Key words:  kinetic model      chemical plating nickel      boron nitride micro-particle      
Received:  19 February 2003     
ZTFLH:  TQ153.12  

URL: 

https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y2004/V40/I2/173

[1] Li F, Zhang D J, Li B H, Luo S M. Chin J Proc Eng, 2002; 2: 425(李钒,张登君,李报厚,罗世民.过程工程学报,2002;2:425)
[2] Levy D J. Electrochem Technol, 1963; 1: 38
[3] Liang H Z, Sun J C, Huang J Z, Li J Y. Eng Chem Metall, 1984: 5: 18(梁焕珍,孙京成,黄建忠,李晋尧.化工冶金,1984;5:18)
[4] Chai L Y. Zhong H Y, Min X B. J Cent South Univ Technol (Nat Sci), 1997; 28: 470(柴立元,钟海云,闵小波.中南工业大学学报(自然科学版),1997;28:470)
[5] Shao Z C, Tian Y W, Zhai Y C, Li B S. J Inorg Mater, 1999: 14: 397(邵忠财,田彦文,翟玉春,李保山.无机材料学报,1999;14:397)
[6] Egorova L G, Sakhieva A S, Bassele A B, Vreyter A L, Lozhnikova O P. Prot Met, 1975; 11: 505 (1975; 11: 505)
[7] Jiang X X, Shen W. The Fundamental and Practice of Electroless Plating. Beijing: National Defence Industry Press, 2000: 23(姜晓霞,沈伟.化学镀理论与实践.北京:国防工业出版社,2000:23)
[8] Chen J Y, Yang S Z, Ke J J, Mao M H. Research and Development of Hydrometallurgy. Beijing: Metallurgical Industry Press, 1998: 444(陈家镛,杨守志,柯家骏,毛铭华.湿法冶金的研究与发展.北京:冶金工业出版社,1998:444)
[9] Zhou G D, Duan L Y. The Fundamental of Structural Chemistry. 2nd ed., Beijing: Peking University Press, 1995: 473(周公度,段连运.结构化学基础.第2版,北京:北京大学出版社,1995:473)
[10] L M X, Huang C B, Song Y J. Chemical Power Source. Tianjin: Tianjin University Press. 1992: 127(吕鸣祥,黄长保,宋玉瑾.化学电源.天津:天津大学出版社,1992:127)
[11] Zhang J Y, Zhou T P, Ma Y J, Fang X L, Lei J B. Steel Res, 1997; 68: 3
[12] Qu J X, Wang H H. Handbook of Surface Engineering. Beijing: Chemical Industry Press, 1998: 179(曲敬信,汪鸿宏.表面工程手册.北京:化学工业出版社,1998:179)
[1] CHEN Weiwu;ZOU Zongshu; WANG Tianming(Northeastern University; Shenyang110006). NEW PROCESS FOR SYNTHETIC SiC WHISKERS BY CVD[J]. 金属学报, 1997, 33(6): 643-649.
No Suggested Reading articles found!