A NEW TECHNOLOGY OF OXIDATION RESISTANCE OF COPPER FOIL

Acta Metall Sin

1998, Vol. 34

Issue (11): 1230-1232 DOI:

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A NEW TECHNOLOGY OF OXIDATION RESISTANCE OF COPPER FOIL

XU Shumin;LENG Daguang (Zhaoyuan JINBAO Electronics Co.Ltd;Zhaoyuan 265400)

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XU Shumin;LENG Daguang (Zhaoyuan JINBAO Electronics Co.Ltd;Zhaoyuan 265400). A NEW TECHNOLOGY OF OXIDATION RESISTANCE OF COPPER FOIL. Acta Metall Sin, 1998, 34(11): 1230-1232.

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Abstract The specification requirements of oxidation resistance of copper foil at 180℃ and the technological proceeding condition were briefly discussed. A new composition of passivating solution and conditions were suggested and verified to be effective for improving the oxidation resistance of copper foil.The mechanism of oxidation resistance was also discussed.

Key words: copper foil oxidation resistance passivating film alkaline passivating solution

Received: 18 November 1998

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https://www.ams.org.cn/EN/ OR https://www.ams.org.cn/EN/Y1998/V34/I11/1230

1马龙英有色冶炼,1989;(5):47(MALY.Non—Ferrous Met Smelt,1989;(5):47)
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[1]	LENG Daguang;HU Jingjiang;GUO Zongxun;XU Shumin (Zhaoyuan;JINBAO Electronics Co. Ltd; Shandong 265400). RESEARCH OF GALVANIZED PROCESS OF ELECTROLYTIC COPPER FOIL[J]. 金属学报, 1998, 34(11): 1227-1229.

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