Research Progress in the Design and Preparation of Advanced Conductive Copper Matrix Composites

doi:10.11900/0412.1961.2025.00047

Acta Metall Sin

2026, Vol. 62

Issue (2): 289-308 DOI: 10.11900/0412.1961.2025.00047

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Research Progress in the Design and Preparation of Advanced Conductive Copper Matrix Composites

JIANG Yihui¹^,²^,³, ZHANG Xingde¹, SHI Hao¹^,²^,³, CAO Fei¹^,²^,³, MA Wenjun¹, WANG Yanfang¹^,²^,³, LIANG Shuhua¹^,²^,³(

)

1 School of Materials Science and Engineering, Xi'an University of Technology, Xi'an 710048, China
2 Engineering Research Center of Conducting Materials and Composite Technology, Ministry of Education, Xi'an University of Technology, Xi'an 710048, China
3 Shaanxi Province Key Laboratory of Electrical Materials and Infiltration Technology, Xi'an University of Technology, Xi'an 710048, China

Cite this article:

JIANG Yihui, ZHANG Xingde, SHI Hao, CAO Fei, MA Wenjun, WANG Yanfang, LIANG Shuhua. Research Progress in the Design and Preparation of Advanced Conductive Copper Matrix Composites. Acta Metall Sin, 2026, 62(2): 289-308.

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Abstract

Copper matrix composites are expected to be essential conductive materials for harsh service environments in the future, due to their remarkable properties, including high strength, excellent electrical and thermal conductivity, and their resistance to high temperatures, wear, and arc ablation. This paper summarizes the typical materials, primary preparation techniques, microstructures, and properties of conductive copper matrix composites. It further analyzes the basic principles and characteristics of in situ preparation methods. Finally, the relationship between microstructures and the overall properties of various high-strength and high-conductivity copper matrix composites is discussed, and the problems and challenges that future research may face are considered.

Key words: copper matrix composites preparation technology microstructure design property modulation

Received: 24 February 2025

ZTFLH:

TG146.1

Fund: National Natural Science Foundation of China(52322409);National Natural Science Foundation of China(52127802);National Natural Science Foundation of China(52271137)

Corresponding Authors: LIANG Shuhua, professor, Tel: (029)82312185, E-mail: liangsh@xaut.edu.cn

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	JIANG Yihui
	ZHANG Xingde
	SHI Hao
	CAO Fei
	MA Wenjun
	WANG Yanfang
	LIANG Shuhua

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https://www.ams.org.cn/EN/10.11900/0412.1961.2025.00047 OR https://www.ams.org.cn/EN/Y2026/V62/I2/289

Fig.1 Casting technologies of copper matrix composites
(a) electromagnetic stirring casting technology and microstructures^[10]
(b) molten salt reaction casting technology and microstructures^[14] (T—temperature, t—time)
(c) mixed casting technology^[18] and microstructures^[19]

Fig.2 Schematics and microstructures of liquid-solid^[21] (a) and liquid-liquid^[22] (b) reactive spray deposition technologies of copper matrix composites

Fig.3 Additive manufacturing technologies of copper matrix composites (a, b) repeated hot and cold cycles during printing (a) and compression-tension simulation generated by the printing process (b)^[28] (σ_XX, σ_YY, and σ_ZZ are stress components) (c-g) microstructures (c), mechanical (d) and conductivity (e) properties, heat transfer during printing (f), and products (g) of Cu-Cr-Nb alloy formed by additive manufacturing^[33] (LPBF—laser powder-bed-fusion)

Fig.4 Solid in situ preparation technologies of copper matrix composites
(a) oxide particles reinforced copper matrix composites^[39] (F—force. The intergranular Al₂O₃ and intragranular Al₂O₃ particles are indicated by red and blue arrows, respectively)
(b) boride particles reinforced copper matrix composites^[39,45]
(c) nano-carbon reinforced copper matrix composites^[56] (PMMA—polymethylmethacrylate, CVD—chemical vapor deposition, 3D-GN—three-dimensional graphene network)

Fig.5 Liquid-solid in situ preparation technology of copper matrix composites
(a) gas atomization technology and composite powders^[61,62]
(b) microstructure and mechanical property of the sintered composites^[61,63]
(c) fracture characteristics and sintering mechanism of the composites^[63] (TiB_2p—TiB₂ particle)

Fig.6 Effect of micro-reinforcements on mechanical properties of the copper matrix composites and corresponding mechanism
(a) heterogeneous deformation caused by particle pinning dislocation^[69] (IPF—inverse pole figure, IQ—image quality, KAM—kernel average misorientation)
(b, c) dislocations accumulating at the reinforcement interface^[19]
(d) debonding of the reinforcements interface^[19]
(e) stress concentration occurs at interface^[19]

Fig.7 Mechanisms of current-carrying friction and wear and electric contact resistance of copper matrix composites
(a) self-lubricating mechanism of graphene^[75] (UF#G—ultra-flat reduced graphene oxide, CE#G—curly edge reduced graphene oxide, IW#G—internal wrinkle reduced graphene oxide)
(b) arc erosion resistance mechanism of copper matrix composites reinforced by dual-scale TiB₂ particles^[79]

Fig.8 Effect of nano-reinforcements on mechanical properties and electrical conductivity of copper matrix composites
(a) interaction mechanism between dislocation and nano-SiC particles^[82] (ε—strain)
(b) interaction between nano-particles and electrons^[71] (E—energy state, ε_F—Fermi level, k_B—Boltzmann constant, r— distance)
(c) microstructure and strength-plasticity of LaB₆/Cu composites^[27]

Fig.9 Relationship between tensile strength and electrical conductivity of the common copper matrix composites^{[3,23,27,33,34,36,39,63,69,78,86,88-93]} (CNTs—carbon nanotubes)

Fig.10 Microstructures and properties of copper matrix composites reinforced with micro-nano dual-scale particles^[96]
(a) microstructures of HfB₂/Cu-Hf composites
(b) hybrid structures improved strain distribution (ε_xx —microscopic strain)
(c) interaction between micro- and nano-particles with dislocation
(d) effect of hybrid structures on matrix characteristics
(e) mechanical properties of hybrid composites
(f) softening resistance of 2HfB₂/Cu-0.9Hf composites

Fig.11 Microstructures and properties of multi-reinforcements reinforced copper matrix composites
(a) Al₂O₃ particles and TiB₂ particles hybrid reinforced copper matrix composites^[97] (CR—cold rolling)
(b) TiB₂ particles and TiB whiskers (TiB_w) hybrid reinforced copper matrix composites^[83]
(c) Al₂O₃ particles and CNTs hybrid reinforced copper matrix composites^[99]

Fig.12 Microstructures and strength-plasticity of unconnected configuration composites
(a) microstructure and fracture diagram of CuCrZr/Cu composites^[105] (ULT 40-40 represents the CuCrZr/Cu composites with the thicknesses of CuCrZr layers 40 μm and Cu layers 40 μm)
(b) microstructure diagram of RGrO and strength-plasticity curves of RGrO/Cu composites^[107] (RGrO—reduced graphene oxide, % refers to volume fraction)

Fig.13 Microstructures and strength-plasticity of connected configuration composites
(a) heterogeneous structure and mechanical properties of GNS/Cu composites^[108] (GNS—graphene or graphene-like carbon nanosheet, RD—rolling direction, ND—normal direction, DC—direct current)
(b) microstructures and preparation process of 3D-GN/Cu composites^[109]

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