itanium alloy is an important structural material in the aerospace field, and the preparation of large-scale homogenized titanium alloy billets is a key issue in the manufacturing of aerospace equipment. Based on the thermo-mechanical field addition forging and forming process for billet preparation, this paper further proposes a new thermo-mechanical-electrical multi-field addition forging and forming process for titanium alloys. It systematically investigated the effects of thermo-mechanical-electrical multi-field action on the interface structure evolution, healing effect, and mechanical properties of TC4 titanium alloy addition forging interfaces. By means of experimental methods such as optical microscopy (OM), scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), and uniaxial tensile testing, the microstructural characteristics and mechanical properties of the addition forging interfaces under different current loadings were studied, and the influence mechanism of thermo-mechanical-electrical multi-field action on the healing effect of the addition forging interfaces was revealed. The research results show that introducing an appropriate current (24A) during the interface addition forging process can promote interface recrystallization, interface oxygen atom diffusion, and reduce interface internal stress, thereby significantly improving the healing effect of the addition forging interface; however, under a high current (48 A), the matrix material is obviously softened, and there is deformation incoordination between the matrix material and oxides, resulting in a large number of pores and undissolved oxides remaining at the interface. The research results confirm the improvement effect of interface healing under thermo-mechanical-electrical multi-field action, and provide an innovative idea for the preparation of large-scale homogenized titanium alloy billets.