离子镀过程中基体“热影响区”的演变及其对镀层的影响

  • 郭腾 ,
  • 李洪涛 ,
  • 蒋百灵 ,
  • 邢益彬 ,
  • 张新宇
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  • 1 西安理工大学材料科学与工程学院 西安 710048
    2 南京工业大学材料科学与工程学院 南京 211816

作者简介 郭 腾,女,1990年生,硕士生

收稿日期: 2017-04-07

  网络出版日期: 2017-08-15

基金资助

资助项目 国家自然科学基金项目No.51401106

Evolution of Substrate "Heat Affected Zone" in Ion Plating and Its Effect on Coatings

  • Teng GUO ,
  • Hongtao LI ,
  • Bailing JIANG ,
  • Yibin XING ,
  • Xinyu ZHANG
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  • 1 School of Materials Science and Engineering, Xi′an University of Technology, Xi'an 710048, China;
    2 School of Materials Science and Engineering, Nanjing Tech University, Nanjing 211816, China

Received date: 2017-04-07

  Online published: 2017-08-15

Supported by

Supported by National Natural Science Foundation of China (No.51401106)

摘要

以淬火态40CrNiMoA为基材,研究了靶功率密度对“热影响区”升温幅度、区域尺度及镀层结构的影响规律。结果表明,随着靶功率密度从20.61 W/cm2提高到143.01 W/cm2,不仅与镀层比邻的基体温度从310 ℃升高到525 ℃、“热影响区”的尺度从0.37 mm增加到2.51 mm,而且纯Ti镀层的择优取向由(002)转变为(110),平均晶粒尺寸由9.9 nm增大至19.5 nm,表面粗糙度先减小后增大。同时,当基体温度大于300 ℃时,镀层的内应力随着晶格微观缺陷的消除而释放。

本文引用格式

郭腾 , 李洪涛 , 蒋百灵 , 邢益彬 , 张新宇 . 离子镀过程中基体“热影响区”的演变及其对镀层的影响[J]. 金属学报, 2018 , 54(3) : 463 -469 . DOI: 10.11900/0412.1961.2017.00121

Abstract

In the process of depositing coatings on the surface of metal substrates via ion plating, substrate temperature increases due to the bombardment of deposited particles and the heat radiation of discharge target, forming "heat affected zone" where substrate temperature gradually reduces from the surface. In this work, quenched 40CrNiMoA was prepared as substrate to discuss about the influence of target power density on the temperature rising range, region scale of "heat affected zone" and microstructure of Ti coating. The results show that the traditional metal heat treatment method can accurately characterize temperature rising range and region scale of "heat affected zone". And, with target power density increases from 20.61 W/cm2 to 143.01 W/cm2, substrate temperature ranges from 310 ℃ to 525 ℃, the region scale of "heat affected zone" reaches to 2.51 mm. Also, the preferential orientation of Ti coating changes from (002) to (110), the average grain size significantly increases from 9.9 nm to 19.5 nm, the surface roughness declines first and then increases slightly. In addition, the internal stress releases gradually for elimination of lattice defects when substrate temperature is above 300 ℃.

参考文献

[1] Louring S, Madsen N D, Sillassen M, et al.Microstructural, mechanical and tribological analysis of nanocomposite Ti-C-N coatings deposited by industrial-scale DC magnetron sputtering[J]. Surf. Coat. Technol., 2014, 245: 40
[2] Yeh T S, Wu J M, Hu L J.The properties of TiN thin films deposited by pulsed direct current magnetron sputtering[J]. Thin Solid Films, 2008, 516: 7294
[3] Zuo J, Xie Y N, Zhang J, et al.TiN coated stainless steel bracket: Tribological, corrosion resistance, biocompatibility and mechanical performance[J]. Surf. Coat. Technol., 2015, 277: 227
[4] Tian M B.Thin Film Technologies and Materials [M]. Beijing: Tsinghua University Press, 2006: 493(田民波. 薄膜技术与薄膜材料 [M]. 北京: 清华大学出版社, 2006: 493)
[5] Gong C.Study of droplets and its effect on performance of TiN films prepared by arc ion plating [D]. Changsha: Central South University, 2013(龚才. 电弧离子镀TiN薄膜表面液滴及其对薄膜性能的影响研究 [D]. 长沙: 中南大学, 2013)
[6] Zhang Y J, Wu Z G, Zhang W W, et al.Comparative study on the tribological properties of TiN films prepared by multi arc ion plating and filtered cathodic arc plasma deposition[J]. Tribology, 2004, 24: 498(张玉娟, 吴志国, 张伟伟等. 多弧镀及磁过滤阴极弧沉积TiN薄膜的摩擦学性能对比 [J]. 摩擦学学报, 2004, 24: 498)
[7] Xiao J Q, Lang W C, Zhao Y H, et al.Influence of axisymmetric magnetic field on microstructure and friction performance of TiN film deposited by arc ion plating[J]. Acta Metall. Sin., 2011, 47: 566(肖金泉, 郎文昌, 赵彦辉等. 轴对称磁场对电弧离子镀TiN薄膜结构及摩擦性能的影响 [J]. 金属学报, 2011, 47: 566)
[8] Anton J M, Mishra B, Moore J J, et al.Investigation of processing parameters for pulsed closed-field unbalanced magnetron co-sputtered TiC-C thin films[J]. Surf. Coat. Technol., 2006, 201: 4131
[9] Lin J, Moore J J, Mishra B, et al.Syntheses and characterization of TiC/a∶C composite coatings using pulsed closed field unbalanced magnetron sputtering (P-CFUBMS)[J]. Thin Solid Films, 2008, 517: 1131
[10] Bai X.Calculation of deposition temperature of substrate via pulsed-bias arc ion plating and preliminary study on nano- multilayer hard films [D]. Dalian: Dalian University of Technology, 2004(白晓. 脉冲偏压电弧离子镀基体沉积温度的计算与纳米多层硬质薄膜的初步研究[D]. 大连: 大连理工大学, 2004)
[11] Dai H Y, Jiang H, Zhan C Y, et al.Effects of sputtering current on the bonding structure and mechanical properties of diamond-like carbon films deposited by MFPUMST[J]. Surf. Interface Anal., 2009, 41: 560
[12] Chowdhury S, Laugier M T, Rahman I Z. Effects of substrate temperature on bonding structure and mechanical properties of amorphous carbon films [J]. Thin Solid Films, 2004, 448-448: 174
[13] Kim D, Han Y, Cho J S, et al. Low temperature deposition of ITO thin films by ion beam sputtering [J]. Thin Solid Films, 2000, 377-378: 81
[14] Magnus F, Ingason A S, Sveinsson O B, et al.Morphology of TiN thin films grown on SiO2 by reactive high power impulse magnetron sputtering[J]. Thin Solid Films, 2011, 520: 1621
[15] Patsalas P, Charitidis C, Logothetidis S.The effect of substrate temperature and biasing on the mechanical properties and structure of sputtered titanium nitride thin films[J]. Surf. Coat. Technol., 2000, 125: 335
[16] Subramanian B, Ashok K, Jayachandran M.Effect of substrate temperature on the structural properties of magnetron sputtered titanium nitride thin films with brush plated nickel interlayer on mild steel[J]. Appl. Surf. Sci., 2008, 255: 2133
[17] Zhang L, Shi L Q, He Z J, et al.Deposition of dense and smooth Ti films using ECR plasma-assisted magnetron sputtering[J]. Surf. Coat. Technol., 2009, 203: 3356
[18] Zhao S S, Yang Y, Li J B, et al.Effect of deposition processes on residual stress profiles along the thickness in (Ti, Al)N films[J]. Surf. Coat. Technol., 2008, 202: 5185
[19] Zhang L, He Z B, Liao G, et al.Influence of B doping on structure and properties of Ti thin film[J]. Acta Phys. Sin., 2012, 61: 186803(张玲, 何智兵, 廖国等. B掺杂对Ti薄膜结构与性能的影响 [J]. 物理学报, 2012, 61: 186803)
[20] Dong M L, Cui X F, Wang H D, et al.Effect of different substrate temperatures on microstructure and residual stress of Ti films[J]. Rare Met. Mater. Eng., 2016, 45: 843
[21] Cheng B X.A study of the structure and properties of Al and Cu films fabricated by magnetron sputtering [D]. Chengdu: Sichuan University, 2007(程丙勋. 磁控溅射制备Al膜和Cu膜的结构与性能研究 [D]. 成都: 四川大学, 2007)
[22] Duan L L.Studies on the structure and properties of Ti films fabricated by magnetron sputtering [D]. Lanzhou: Lanzhou University, 2008(段玲珑. 磁控溅射制备Ti膜的结构与性能研究[D]. 兰州: 兰州大学, 2008)
[23] Chawla V, Jayaganthan R, Chawla A K, et al.Morphological study of magnetron sputtered Ti thin films on silicon substrate[J]. Mater. Chem. Phys., 2008, 111: 414
[24] Brama Y L, Sun Y, Dangeti S R K, et al. Response of sputtered titanium films on silicon to thermal oxidation[J]. Surf. Coat. Technol., 2005, 195: 189
[25] Yang C, Jiang B L, Liu Z, et al.Nanocrystalline titanium films deposited via thermal-emission-enhanced magnetron sputtering[J]. Thin Solid Films, 2015, 597: 117
[26] Yang C, Jiang B L, Feng L, et al.Effect of discharge characteristics of target on ionization and deposition of deposited particles[J]. Acta Metall. Sin.,2015, 51: 1523(杨超, 蒋百灵, 冯林等. 靶面放电特性对沉积粒子离化率及沉积行为的影响 [J]. 金属学报, 2015, 51: 1523)
[27] Nakamura T, Okimura K.Ti ion density in inductively coupled plasma enhanced dc magnetron sputtering[J]. Vacuum, 2004, 74: 391
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