论文

电流密度对V-4Cr-4Ti合金基体上电沉积W涂层显微结构的影响

  • 李绪亮 ,
  • 张迎春 ,
  • 江凡 ,
  • 王莉莉 ,
  • 刘艳红 ,
  • 孙宁波
展开
  • 北京科技大学材料科学与工程学院, 北京 100083
李绪亮, 男, 1988年生, 硕士生

收稿日期: 2013-01-23

  修回日期: 2013-04-16

  网络出版日期: 2013-06-11

基金资助

国际热核聚变实验堆(ITER)计划专项项目2010GB109000和国家自然科学基金项目50972008资助

EFFECTS OF CURRENT DENSITY ON MICROSTRUCTURE OF W COATING ON V-4Cr-4Ti ALLOY BY ELECTRODEPOSITION

  • LI Xuliang ,
  • ZHANG Yingchun ,
  • JIANG Fan ,
  • WANG Lili ,
  • LIU Yanhong ,
  • SUN Ningbo
Expand
  • School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083

Received date: 2013-01-23

  Revised date: 2013-04-16

  Online published: 2013-06-11

摘要

利用Na2WO4-WO3熔盐体系在V-4Cr-4Ti合金基体上电沉积制备了金属W涂层,在电流密度为10-160 mA/cm2范围内研究了电流密度对金属W涂层的显微结构和力学性能的影响.研究结果表明, 增大电流密度促进了W晶核的生长以及晶粒尺寸的增大. W原子更容易在V-4Cr-4Ti合金基体上形核,而在初始W晶核上继续沉积主要是W晶核长大的过程,电流密度较大(100 mA/cm2)时, W涂层的金相组织呈柱状和条状结构, 电流密度较小时,W涂层组织呈牙柱状. W涂层的硬度随着电流密度的增加而下降,W涂层与V-4Cr-4Ti合金基体的结合强度超过59.36 MPa. 电流密度为10 mA/cm2时, 虽然涂层厚度仅有10 μm, 但W涂层晶粒尺寸小于5 μm, 涂层硬度、电流效率以及涂层和基体的结合力达到最大值, 分别为628.42 HV, 99.71%和96 N.

本文引用格式

李绪亮 , 张迎春 , 江凡 , 王莉莉 , 刘艳红 , 孙宁波 . 电流密度对V-4Cr-4Ti合金基体上电沉积W涂层显微结构的影响[J]. 金属学报, 2013 , 49(6) : 745 -750 . DOI: 10.3724/SP.J.1037.2013.00042

Abstract

The W coatings prepared on structure materials (V-4Cr-4Ti) as plasma facing materials, not only can release impinging thermal power but also can resist erosion under plasma particles bombardment in international thermonuclear experimental reactor. The electro deposition of W in Na2WO4-WO3 melt as a promising technique was studied in this work. The effects of current density on microstructure and mechanical properties of W coating were investigated, and the results show that, with the increasing of the current density, the trend of crystal growth is promoted and the grain size of W coatings increased. The nucleation easily occurs on V-4Cr-4Ti alloy substrate for W atom, and after that, the growth of crystal nuclei is the most important factor for the formation of coatings. When the current density increases to 100 mA/cm2, the metallographic structure of W coatings presents columnar or stripy structure, and tooth-like grains were presented in microstructure as current density is lower. The Vickers micro-hardness of W coatings is decreased as increasing current density, and the adhesive strength of the coatings is greater than 59.36 MPa by the tensile test. Although the thickness of tungsten coatings is 10 μm as current density is 10 mA/cm2, grain size is less than 5 μm, Vickers hardness, current efficiency and the coatings adhesion are all maximum, and the values are 628.42 HV, 99.71% and 96 N respectively.

参考文献

[1] Ma R X, Zhou C H, Li G X.  Chin J Nonferrous Met, 2000; 10: 715

 (马瑞新, 周传华, 李国勋. 中国有色金属学报, 2000; 10: 715)
[2] Liu Y H, Zhang Y C, Ge C C.  Mater Sci Eng Powder Metall, 2011; 16: 315
 (刘艳红, 张迎春, 葛昌纯.粉末冶金材料科学与工程, 2011; 16: 315)
[3] Bolt H, Barabash V, Krauss W, Linke J, Neu R, Suzuki S, Yoshida N.  J Nucl Mater, 2002; 329-333: 66
[4] Xu Z Y.  Atom Energy Sci Technol, 2003; 37(suppl): 105
 (许增裕. 原子能科学与技术, 2003; 37(增刊): 105)
[5] Nishimura A, Iwahori A, Heo N J, Nagasaka T, Muroga T, Tanaka S I.  J Nucl Mater, 2004; 329-333: 438
[6] Senderoff S, Mellors G W.  Science, 1966; 153: 1475
[7] Katagiri A.  J Electrochem Soc, 1991; 38: 768
[8] Masuda M, Takenishi H, Katagiri A.  J Electrochem Soc, 2001; 148: 60
[9] Nakajima H, Nohira T, Hagiwara H, Nitta K, Inazawa S, Okada K.
 Electrochim Acta, 2007; 53: 25
[10] Wu Z D.  Acta Chemica Sin, 1990; 48: 895
 (吴仲达. 化学学报, 1990; 48: 895)
[11] Malyshev V V.  Protect Met, 2001; 37: 247
[12] Ma R X, Lin W, Wu Z L, Kang B, Wang M K.  Mater Sci Technol, 2009; 17: 754
 (马瑞新, 林炜, 吴中亮, 康勃, 王目孔.材料科学与工艺, 2009; 17: 754)
[13] Li Y G.  PhD Dissertation, Northeastern University, Shenyang, 2005
 (李运刚. 东北大学博士学位论文, 沈阳, 2005)
[14] Liu Y H, Zhang Y C, Liu Q Z.  Rare Met Mater Eng, 2011; 40: 436
 (刘艳红, 张迎春, 刘其宗. 稀有金属材料与工程, 2011; 40: 436)
[15] Liu Y H, Zhang Y C, Liu Q Z, Li X L, Jiang F.  Int J Refract Met Hard Mater, 2012; 35: 241
[16] Liu Y H, Zhang Y C, Liu Q Z, Li X L, Jiang F.  Fusion Eng Des, 2012; 87: 1861
[17] Zhang Q X, Zhao Q S.  Tungsten and Molybdenum Metallurgy.Beijing: Metallurgical Industry Press, 2005: 65
 (张启修, 赵秦生. 钨钼冶金. 北京: 冶金工业出版社, 2005: 65)
[18] Zhou S M.  Principle and Methodology for Electrodeposition.Shanghai: Shanghai Science and Technology Press, 1987: 124
 (周绍民. 金属电沉积-原理与研究方法. 上海: 上海科学技术出版社, 1987: 124)
[19] Budevski E, Staikov G, Lorenz W J.  Electrochem Acta, 2000; 45: 2559
[20] Hirai T, Pintsuk G, Linke J, Batilliot M.  J Nucl Mater, 2009; 390-391: 751
[21] Pintsuk G, Prokhodtseva A.  J Nucl Mater, 2011; 417: 483
[22] Koji N, Toshiyuki N, Rika H.  J Appl Electrochem, 2010; 40: 1443
[23] Yu Y N.  Principles of Metallography. Beijing: Metallurgical Industry Press, 2000: 275
 (余永宁. 金属学原理. 北京: 冶金工业出版社, 2000: 275)
[24] Chen F C, Xiao X, Zhou Q, He D L.  Contemporary Electroplating Technology.Beijing: China Textile & Apparell Press, 2009:46
 (陈范才, 肖鑫, 周琦, 何德良. 现代电镀技术. 北京: 中国纺织出版社, 2009: 46)
[25] Sethi R S.  J Appl Eletrochem, 1979; 9: 419
[26] Simka W, Puszczyk D, Nawrat G.  Electrochim Acta, 2009; 54: 5310
文章导航

/