纳米压痕法测量Cu膜的硬度和弹性模量
收稿日期: 2009-12-24
修回日期: 2010-04-15
网络出版日期: 2010-09-11
基金资助
国家自然科学基金项目50571097和江西省自然科学基金项目2007GZC0712资助
MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION
Received date: 2009-12-24
Revised date: 2010-04-15
Online published: 2010-09-11
Supported by
Supported by National Natural Science Foundation of China (No.50571097) and Natural Science Foundation of Jiangxi Province (No.2007GZC0712)
黎业生 , 汪伟 . 纳米压痕法测量Cu膜的硬度和弹性模量[J]. 金属学报, 2010 , 46(9) : 1098 -1102 . DOI: 10.3724/SP.J.1037.2009.00859
Hardness (H) and elastic modulus (E) of 1 $\mu$m thick Cu film deposited on Si substrate were measured by means of nanoindentation technique. The E value of Cu film obtained by using single stiffness measurement (SSM) is consistent with that obtained from continuous stiffness measurement (CSM). However, the H value obtained from SSM is much smaller than that from CSM because of occurrence of significant creep during the holding period at ambient temperature. The analysis of loading curves shows that the substrate effect on hardness measurement appears as the indentation depth is about 528-587 nm, indicating the ratio of penetration depth to film thickness (about 0.5) is consistent with the finite element calculation.
Key words： nanoindentation; Cu film; hardness; elastic modulus
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