Sn-3.5Ag/Cu体系早期界面反应及凝固过冷行为
收稿日期: 2009-08-31
修回日期: 2010-01-27
网络出版日期: 2010-05-11
基金资助
新世纪优秀人才计划项目NCET-04-0824及广东省重大科技专项项目2009A080204005资助
EARLY INTERFACIAL REACTION AND UNDERCOOLING SOLIDIFICATION BEHAVIOR OF Sn-3.5Ag/Cu SYSTEM
Received date: 2009-08-31
Revised date: 2010-01-27
Online published: 2010-05-11
Supported by
Supported by Program of New Century Excellent Talents in University (No.NCET-04-0824) and Science and Technology Major Project of Guangdong Province (No.2009A080204005)
周敏波 , 李勋平 , 马骁 , 张新平 . Sn-3.5Ag/Cu体系早期界面反应及凝固过冷行为[J]. 金属学报, 2010 , 46(5) : 569 -574 . DOI: 10.3724/SP.J.1037.2009.00566
For electronic packaging technologies using lead-free solders, one of the major problems related to reliability for the solder interconnects is the existence of the interfacial intermetallic compound (IMC). The interfacial failures between IMC and solder alloy often lead to loss of function in interconnects and result in product failure. Therefore, considerable attention has been focused on study of formation, growth and control of IMC during solder process. In this paper, the early interfacial reaction in Sn-3.5Ag/Cu (UBM) system and the system's melting and solidification characteristics were investigated using differential scanning calorimeter incorporating with reflow process. The results show that during heating the diffusion of Cu atom into Sn-3.5Ag solder results in the formation of Sn-Ag-Cu ternary alloy at the interface before melting of Sn-3.5Ag solder and the ternary eutectic system melts at a temperature nearly 4 ℃ lower than Sn-3.5Ag solder's melting temperature. The early interfacial reaction also leads to earlier wetting of the liquid solder alloy at the interface, and consequently brings about formation of scallop-type Cu-Sn intermetallics layer with a certain thickness as well as makes the initial Sn-3.5Ag/Cu system changed into Sn-Ag-Cu/Cu system, which makes the undercooling of the solder alloy decrease obviously.
Key words： lead-free solder; interfacial reaction; intermetallics; undercooling
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