金属学报  2005, Vol. 41 Issue (7): 755-758

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Cu--Sn合金急冷箔储能焊接头的形貌特征与形成机制

翟秋亚 徐锦锋

西安理工大学材料科学与工程学院;西安 710048

Morphological Characteristic and Formation Mechanism of Joint of Meltspun Cu—Sn Alloy Foils By Capacitor Discharge Welding

ZHAI Qiuya; XU Jinfeng

School of Materials Science and Engineering; Xi'an University of Technology; Xi'an 710048

翟秋亚; 徐锦锋 . Cu--Sn合金急冷箔储能焊接头的形貌特征与形成机制[J]. 金属学报, 2005, 41(7): 755-758 .
, . Morphological Characteristic and Formation Mechanism of Joint of Meltspun Cu—Sn Alloy Foils By Capacitor Discharge Welding[J]. Acta Metall Sin, 2005, 41(7): 755-758 .

摘要 参考文献 相关文章 Metrics 全文: PDF(205 KB)   摘要: 应用自制的微型电容储能电阻焊机研究了快速凝固Cu--20%Sn包晶合金的储能焊连接行为及接头组织特征。微型接头由熔核区、半熔化区及热影响区组成，熔核为以细密--Cu5.6Sn等轴晶为主相的快速凝固组织, 熔合区宽度仅2.0---3.0 m,热影响区组织未发生明显变化, 储能焊接头组织与快速凝固箔材一致性好。在电极压力及电磁力的共同作用下,过冷熔核中发生了一定程度的液相流动, 形成以加压电极为对称轴向四周辐射, 并以结合面为对称面, 向侧面延伸的弯曲流线。气孔是快速凝固Cu--Sn合金储能焊接头主要的焊接缺陷。随电极压力的增大, 气泡半径急剧减小, 当电极压力大于1.0 MPa时, 该减小趋势趋于缓和。液相流动促进气泡的碰撞、合并及迁移是气孔沿熔核周边分布的主要原因。 关键词 ： Cu--Sn合金,  急冷箔,  电容储能电阻焊     Abstract：The connection behavior and joint microstructure of capacitor discharge welding for melt--spun Cu--20%Sn alloy foils are investigated by using a micro--type capacitor discharge welding machine. The micro joint consists of nugget zone, semi--melt zone and heat affect zone. The rapid solidification microstructure characterized mainly by fine b--Cu5.6Sn equiaxed grains are produced in the nugget. The thickness of semi--melt zone is only 2.0---3.0um and there is no obvious change of microstructure in heat--affected zone. Under the electrode pressure and electromagnetic force, the liquid phase flow occurs in undercooled nugget, which is symmetrical about the electrode axis and connection interface and results in the formation of curving streamline. The porosity is the main welding defect produced during welding. With the increase of electrode pressure pm, the radius of porosity sharply decreases. If the electrode pressure is more than 1.0 MPa, this decrease tendency becomes smooth. The liquid phase flow promotes the collision, coalescence and movement of bubbles, resulting in that porosities distribute along the periphery of nugget. Key words： Cu--Sn alloy    melt--spun foil    capacitor discharge welding 收稿日期: 2004-11-07      ZTFLH:  TG457.13   服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 翟秋亚 徐锦锋 44.8K 链接本文: https://www.ams.org.cn/CN/      或      https://www.ams.org.cn/CN/Y2005/V41/I7/755 [1] Lee K L, Hu C K. J Appl Phys, 1995; 78: 4428 [2] Hu C K, Luther B, Kaufman F B, Hummel J, Uzoh C, Pearson D J. Thin Solid Films, 1995; 262: 84 [3] Huang J S, Zhang J, Cuevas A, Tu K N. Mater Chem Phys, 1997; 49: 33 [4] Kim H K, Tu K N. Appl Phys Lett, 1995; 67(14): 2002 [5] Clevenger L A, Arcot B, Ziegler W et al. J Appl Phys, 1998; 83(1): 90 [6] Al-Ganainy G S, Fawzy A, Ei-Salam F A. Physica, 2004; 344B: 443 [7] Liu X Y, Kane W, McMahon C J. Scr Mater, 2004; 50: 673 [8] Xu J F, Zhai Q Y, Yuan S. J Mater Sci Technol, 2004; 20(4): 431 [9] Ellis M B D. Int Mater Rev, 1996; 41(2): 41 [10] Xu J F, Wei B B. Ada Phys Sin, 2004; 53(6): 160 (徐锦锋,魏炳波．物理学报,2004;53(6):160) [11] Zhai Q Y, Lei M, Xu J F. Trans Chin Weld Inst, To be published (翟秋亚,雷鸣,徐锦锋．焊接学报,待发表) [12] Brandes E A. Smithells Metals Reference Book. 6th Ed. London: Butterworth & Co (Publishers) Ltd., 1983: 14q No related articles found! Viewed Full text Abstract Cited   Shared      Discussed