金属学报  2005, Vol. 41 Issue (12): 1277-1279

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喷射沉积制备新型电子封装材料70%Si-Al的研究

王晓峰; 赵九洲; 田冲

中国科学院金属研究所; 沈阳 110016

STUDY OF NOVEL ELECTRONIC PACKAGING MATERIAL 70%Si-Al PREPARED BY THE SPRAY DEPOSITION

WANG Xiaofeng; ZHAO Jiuzhou; TIAN Chong

Institute of Metal Research; The Chinese Academy Sciences; Shenyang 110016

王晓峰; 赵九洲; 田冲 . 喷射沉积制备新型电子封装材料70%Si-Al的研究[J]. 金属学报, 2005, 41(12): 1277-1279 .
, , . STUDY OF NOVEL ELECTRONIC PACKAGING MATERIAL 70%Si-Al PREPARED BY THE SPRAY DEPOSITION[J]. Acta Metall Sin, 2005, 41(12): 1277-1279 .

摘要 参考文献 相关文章 Metrics 全文: PDF(224 KB)   摘要: 采用喷射沉积技术制备了新型电子封装材料70%Si-Al合金, 对其进行热等静压致 密化处理后, 测试了合金的主要性能. 结果表明: 喷射沉积70%Si-Al合金的密度低, 组织细小均匀, 各向同性, Si相粒子尺寸在10-20 μm之间且弥散分布. 新 型70%Si-Al合金具有与Si和GaAs等半导体材料相近的热膨胀系数, 热稳定性好, 经热等静压后合金的性能进一步提高. 喷射沉积70%Si-Al合金具有良好的机械加 工性能, 可以用作功率芯片、微波电子器件、集成电路块等的封装材料. 关键词 ： 70%Si-Al合金,  电子封装材料,  喷射沉积     Abstract：70%Si-Al alloy as a novel electronics package material was prepared by spray deposition. HIP technique was adopted in order to density the billet. The prepared 70%Si-Al alloy has a microstructure with fine silicon particles (10-20 μm in diameter) well dispersed in the matrix. The alloy shows excellent comprehensive properties, especially a lower thermal expansion coefficient and a lower density compared with the traditional electronics packaging materials. After HIP, The comprehensive properties of the 70%Si-Al alloy can be further enhanced. The alloy can be machined with the traditional cutting tools and applied as the packaging materials for the power IC, microwave electronic parts and integrate circuit blocks. Key words： 70%Si-Al alloy    electronics package material    spray deposition 收稿日期: 2005-05-31      ZTFLH:  TG132.11   服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 王晓峰 赵九洲 田冲 44.8K 链接本文: https://www.ams.org.cn/CN/      或      https://www.ams.org.cn/CN/Y2005/V41/I12/1277 [1] White D, Keck S, Smith I. Hybrid Circuits Technol, 1990; 12: 14 [2] Moores K A, Joshi Y K. Future Circuits Int, 2001; 7: 45 [3] Warren H, Hunt W H, Prekumar M K. J Met, 1992; 44: 8 [4] Bocking C, Jacobson D,Bennett G. Trans Inst Met Finish, 2002; 78: 243 [5] Ibrahim I A, Mohamed F A, Lavernia E J. J Mater Sci, 1991; 26: 1137 [6] Rennie A E W, Bocking C E, Bennett G R. J Mater Process Technol, 2001; 110: 186 [7] Jacobson D M, Sangha S P S. IEEE Trans Compon Packag Manufac Technol, 1998; 21A: 515 [8] Leatham A. Mater World, 1996; 4: 317 [9] Zhang Y A, Liu H W, Zhu B H. Chin J Nonferrous Met, 2004; 14(1): 23 [10] Jacobson D M, Sangha S P S. Future Microelectron Int, 1998; 15: 17 [11] Sangha S P S, Jacobson D M, Ogilvy A J W. J Eng Sci Educ, 1997; 11: 195 [12] Jacobson D M. Powder Metall, 2000; 43: 200 [13] Baffett J. Microelectron Reliab, 1998; 38: 1277u [1] 李微 陈振华 陈鼎 滕杰. 喷射沉积SiCp/Al-7Si复合材料的疲劳裂纹扩展[J]. 金属学报, 2011, 47(1): 102-108. [2] 韩伟; 马万太 . 往复式管坯喷射沉积的模型建立及运动参数优化[J]. 金属学报, 2008, 44(4): 501-506 . [3] 刘慧敏; 何建平; 杨滨; 张济山 . 半固态喷射沉积TiCp/7075铝合金的晶粒长大规律[J]. 金属学报, 2006, 42(2): 158-162 . [4] 王洪斌; 崔华; 郝斌; 程军胜; 黄进峰; 张济山 . 喷射沉积超高强Al-Zn-Mg-Cu合金的回归再时效处理[J]. 金属学报, 2005, 41(12): 1267-1271 . [5] 傅晓伟; 张济山 . 喷射沉积过程的计算模型及优化软件[J]. 金属学报, 1999, 35(2): 147-151 . [6] 陈文哲;张飒;钱匡武;顾海澄;王中光. 离心喷射沉积Ti-48Al-2Mn-2Nb的疲劳裂纹扩展速率和门槛值[J]. 金属学报, 1998, 34(1): 70-74. [7] 张济山;崔华;段先进;孙祖庆;陈国良. 雾化喷射沉积成型凝固过程模拟Ⅱ.Al-Cu合金的计算结果[J]. 金属学报, 1998, 34(1): 13-18. [8] 张济山;崔华;段先进;孙祖庆;陈国良. 雾化喷射沉积成型凝固过程模拟研究Ⅰ.理论分析[J]. 金属学报, 1998, 34(1): 7-12. [9] 米国发;罗治平;田世藩;李庆春;曾松岩. 喷射沉积Ni_3Al-Mo合金的显微组织[J]. 金属学报, 1997, 33(6): 566-572. [10] 张济山;刘兴江;崔华;段先进;陈国良. 金属基复合材料相界面区力学性能显微力学探针分析[J]. 金属学报, 1997, 33(5): 548-556. [11] 袁晓光;徐达鸣;张淑英;李庆春. 喷射沉积Al-Si-Fe-Cu-Mg合金的微观组织和力学行为[J]. 金属学报, 1997, 33(3): 248-252. Viewed Full text Abstract Cited   Shared      Discussed