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通孔元件焊点的抗热疲劳性能预测 I. 焊点抗热疲劳能力的实验研究 |
丁颖; 王春青; 田艳红 |
哈尔滨工业大学现代焊接生产技术国家重点实验室; 哈尔滨 150001 |
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引用本文:
丁颖; 王春青; 田艳红 . 通孔元件焊点的抗热疲劳性能预测 I. 焊点抗热疲劳能力的实验研究[J]. 金属学报, 2003, 39(8): 879-884 .
[1] Zarrow P, Kopp D. Print Circ Design, 1997; 14(2) : 25 [2] Glenn R R, Nguyen N. Circ Assem, 1998; 9(11) : 32 [3] Belmonte J, Zarrow P. Circ Assem, 1996; 7(9) : 36 [4] Hymes L. Circ Assem, 1999; 10(4) : 28 [5] Glenn R R. Circ Assem, 1999; 10(4) : 32 [6] William E. Coleman, Denis J, Julie R, Bradbury-Bennett.Solder Surf Mount Technol, 2000; 12(3) : 8 [7] Rutter G. Electr Pack Prod, 1997; 37(6) : 99 [8] Islam J. Electr Prod, 2000; 29(2) : 29 [9] Barker D, Pecht M, Dasgupta A, Naqvi S. J ElectronPackag, 1991; 113(2) : 149 [10] Colin Lea. In: Des Plaines ed, Proc Tech Program Natl Electron Packag Prod Conf, California, Anaheim: Cahner Exposition Group, 1991: 23 [11] Zhang W, Wang C Q. In: Zhang Qun ed, HDP's02-IEEE Symp on High Density Packag and Component Failure Analysis in Electron, Shanghai: IEEE, 2002: 221 [12] Wang Z P, Tan Y M, Chua K M. Microelectron Reliab,1999; 39: 1351 [13] Zhao X J, Wang C Q, Wang G Z, Zheng G Q, Yang S Q.IEEE Trans Electron Packag Manu, 2000; 23(2) : 87 [14] Kanchanomai C, Miyashita Y, Mutoh Y. Int J Fatig, 2002;24: 987 [15] Tu P L, Chan Y C, Tang C W, Hung K C, Lai J K L.IEEE Trans Adv Pack, 2001; 24(2) : 197 [16] Chan Y C, So Alex C K, Lai J K L. Mater Sci Eng B,1998; 55: 5 [17] Pang H L J, Tan K H, Shi X Q, Wang Z P. Mater Sci EngA, 2001; 307: 42 [18] Lee H T, Chen M H. Mater Sci Eng A, 2002; 333: 24K |
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