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金属学报  1991, Vol. 27 Issue (6): 133-137    
  论文 本期目录 | 过刊浏览 |
Sialon陶瓷与40Cr钢连接中缓冲层的作用
冼爱平;斯重遥
中国科学院金属研究所;博士研究生;中国科学院金属研究所
BEHAVIOUR OF BUFFER LAYER IN JOINING OF SIALON CERAMICS TO 4OCr STEEL
XIAN Aiping;SI Zhongyao Institute of Metal Research; Academia Sinica; Shenyang
引用本文:

冼爱平;斯重遥. Sialon陶瓷与40Cr钢连接中缓冲层的作用[J]. 金属学报, 1991, 27(6): 133-137.
, . BEHAVIOUR OF BUFFER LAYER IN JOINING OF SIALON CERAMICS TO 4OCr STEEL[J]. Acta Metall Sin, 1991, 27(6): 133-137.

全文: PDF(496 KB)  
摘要: 本文研究了Sialon陶瓷与40Cr钢活性钎焊连接中缓冲层的作用.结果发现:缓冲层材料本身可能影响活性钎料与陶瓷的界面连接强度,对Ag_(57) Cu_(38) Ti_5活性钎料,Cu和Ta是较好的缓冲层材料,而对 Kovar,Ni-15 Cr-15Co则较差;用软性缓冲层如 Cu来松弛应比用硬性缓冲层如Mo来避免应力更加重要;软性缓冲层有一个合适的厚度范围,其h/L≈0.02—0.1;采用软/硬复合缓冲层可以有效的提高接头强度。最后作者提出了设计梯度材料作为专用缓冲层材料的设想。
关键词 金属与陶瓷的连接Sialon陶瓷40 Cr钢活性钎焊缓冲层    
Abstract:The buffer layer material itself may be influential to the bond strength between active brazing filler and ceramics. For Ag_(57)Cu_(38)Ti_5 filler metal, Cu or Ta is excellent buffer layer material, but Kovar or Ni-15Cr-15Co is worse. It was important to design a layer of soft buffer, such as Cu, to relax interfacial stress rather than hard buffer layer, such as Mo, to avoid stress. There is an optimum thickness range of soft buffer layer, saying h/L=0.02-0.1. It was a good solution to the interfacial stress problem to use soft/bard buffer layer to increase metal/ceramics joint strength. Finally, an idea of designing gradual materials as buffer layer between metal and ceramics was suggested.
Key wordsceramic/metal joining    Sialon    40Cr steel    active brazing    interlayer
收稿日期: 1991-06-18     
基金资助:国家自然科学基金资助项目
1 Pask J A. Am Ceram Soc Bull, 1987; 66: 1587
2 Delannay F, Froyen L, Deruyttere A. J Mater Sci, 1987; 22: 1
3 Eigemann B, Scholtes B, Macherauch E. Mater Sci Eng, 1989; A118: 1
4 Xian A P, Si Z Y. J Mater Sci, 1990; 25: 4483
5 Thiemann K H, Weinert H J, Raeuchle W. GB Pat, 2151173 A1, 1985
6 黄莉萍,黄振坤,徐友仁,符锡仁.无机材料学报,1986;1:123
7 Naka M, Okamoto I, Nishino T, Ural S. Trans JWRI, 1989; 18: 189
8 Ruehle M, Evans A G. Mater Sci Eng, 1989; A107: 187
9 冼爱平,斯重遥.计算机与应用化学,1991;8:232
10 冼爱平,斯重遥.第六届全国焊接学术会议论文集,第1卷西安,1990:160
11 Naka M, Tanaka T, Okamoto I. Trans JWRI, 1985; 14: 285
12 Xian A P, S1 Z Y. J Am Ceram Soc, 1990; 73: 3462
[1] 庄艳歆;冼爱平;王仪康;张修睦;胡壮麒. 粗真空条件下锡基钎料与Sialon陶瓷的润湿和连接[J]. 金属学报, 1996, 32(7): 735-741.