MICROSTRUCTURE EVOLUTION AND MECHANICAL BEHAVIOR OF INTERMETALLIC COMPOUNDS IN SOLDER JOINT

AN Tong; QIN Fei; WANG Xiaoliang

doi:10.3724/SP.J.1037.2013.00186

Acta Metall Sin >

2013 , Vol. 49 >Issue 9: 1137 - 1142

DOI: https://doi.org/10.3724/SP.J.1037.2013.00186

MICROSTRUCTURE EVOLUTION AND MECHANICAL BEHAVIOR OF INTERMETALLIC COMPOUNDS IN SOLDER JOINT

AN Tong ,
QIN Fei ,
WANG Xiaoliang

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Laboratory of Advanced Electronic Packaging Technology & Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124

Received date: 2013-04-15

Revised date: 2013-06-28

Online published: 2013-09-11

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Abstract

Thickness and roughness evolution of the intermetallic compounds (IMC) layer between Sn3.0Ag0.5Cu and Cu substrate are examined under various isothermal aging times at 150℃.The effect of the microstructure evolution of the IMC on the mechanical behavior of solder joints is experimentally investigated. The results show that the growth of the IMC follows the Fick's law that predicts the total mean thickness increases linearly with the square root of the aging time. With the increase of the isothermal aging time, the initial scallop morphology of the solder/IMC interface changes to a more planar type. Both the thickness and roughness of the IMC layer affect the tensile strength and fracture mode of the solder joints. The tensile strength decreases with the increase of either the IMC thickness or the solder/IMC interfacial roughness. With the increase of the isothermal aging time, the IMC thickness increases and the solder/IMC interfacial roughness decreases, and the fracture mode migrates from ductile fracture in bulk solder to brittle fracture in the IMC layer.

Key words： solder joint; intermetallic compound; mechanical behavior; tensile strength; fracture mode

Cite this article

AN Tong , QIN Fei , WANG Xiaoliang . MICROSTRUCTURE EVOLUTION AND MECHANICAL BEHAVIOR OF INTERMETALLIC COMPOUNDS IN SOLDER JOINT[J]. Acta Metall Sin, 2013 , 49(9) : 1137 -1142 . DOI: 10.3724/SP.J.1037.2013.00186

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