With the development of miniaturization of electronic circuits and occurrence of growing number of project failure cases, the corrosion behavior of printed circuit board (PCB) becomes a non-ignorable scientific issue under the hygrothermal condition with mold. In this paper, the corrosion behavior of unfinished PCB (PCB-Cu) and PCB finished by electroless nickel immersion gold (PCB--ENIG) in mold environment was studied using scanning Kelvin probe (SKP). The mold growth behavior was observed by stereo microscope and SEM, and the corrosion products were analyzed by EDS. The results showed that the number of mold increased on the surface of PCB-Cu and PCB-ENIG specimens under hygrothermal condition. After a growth cycle of 28 d, the new generation of conidium formed with good activity. After 84 d mold test, corrosion occurred on both two kinds of specimens and it was more severe on PCB--ENIG. Meanwhile the activity of mold was an inhibitor in the corrosion process of PCB--Cu and a promoter in the pore corrosion process of PCB-ENIG.
ZOU Shi-Wen
,
LI Xiao-Gang
,
DONG Tiao-Fang
,
LI Hui-Yan
,
XIAO Kui
. EFFECT OF MOLD ON CORROSION BEHAVIOR OF PRINTED CIRCUIT BOARD-COPPER AND ENIG FINISHED[J]. Acta Metall Sin, 2012
, 48(6)
: 687
-695
.
DOI: 10.3724/SP.J.1037.2012.00033
[1] Huang H L, Dong Z H, Chen Z Y, Guo X P. Corros Sci, 2011; 53: 1230
[2] Chen D M, Li J G, Su X R, Yang G. Equip Environ Eng, 2006; 3: 78
(陈丹明, 李金国, 苏兴荣, 杨光. 装备环境工程, 2006; 3: 78)
[3] Fang H H P, Xu L C, Chan K Y. Water Res, 2002; 36: 4709
[4] Klintworth R, Reher H J, Viktorov A N, Bohle D. Acta Astronaut, 1999; 44: 569
[5] Liu X F, Chen G M, Wang H G. Corros Sci Prot Technol, 2004; 16: 318
(刘晓方, 陈桂明, 王汉功. 腐蚀科学与防护技术, 2004; 16: 318)
[6] Zhang J Y. Mater Prot, 2007; 40: 59
(张继源. 材料保护, 2007; 40: 59)
[7] Sun H L, Wang X H. Equip Environ Eng, 2008; 5: 49
(孙海龙, 王晓慧. 装备环境工程, 2008; 5: 49)
[8] Liang Z Y, Lin Y S, Ye D Z, Yao R M. Acta Oceanol Sin, 1986; 8: 251
(梁子原, 林燕顺, 叶德赞, 姚瑞梅. 海洋学报, 1986; 8: 251)
[9] Juzeliunas E, Ramanauskas R, Lugauskas A, Samuleviciene A, Leinartas K. Electrochem Commun, 2005; 7: 305
[10] Juzeliunas E, Ramanauskas R, Lugauskas A, Leinartas K, Samuleviciene M, Sudavicius A, Juskenas R. Corros Sci, 2007; 49: 4098
[11] Huang H L, Guo X P, Zhang G A, Dong Z H. Corros Sci, 2011; 53: 1700
[12] Zhang S N, Osterman M, Shrivastava A, Kang R, Pecht M G. IEEE Trans Device Mater Relia, 2010; 10: 71
[13] Gen W Y, Chen X, Hu A M. Microelectron Rel, 2011; 51: 866
[14] Zhao P, Pecht M. Microelectron Rel, 2003; 43: 775
[15] Kleber Ch, Wiesinger R, Schnoller J, Hilfrich U, Hutter H, Schreiner M. Corros Sci, 2008; 50: 1112
[16] Tran T T M, Fiaud C, Sutter E M M. Corros Sci, 2005; 47: 1724
[17] Simeon J K. IEEE T Mater Pack, 1969; 5: 89
[18] Sun A C, Moffat H K, Enos D G, Glauner C S. IEEE Trans Compon Pack T, 2007; 30: 796
[19] Russo S G, Henderson M J, Hinton B R W. Eng Fail Anal, 2002; 9: 423
[20] Morozova E V, Baranova M V, Kozlov V P, Tereshina V M, Memorskaya A S, Feofilova E P. Microbiology, 2001; 70: 527
[21] Abarca M L, Accensi F, Cano J, Cabanes F J. Antonie van Leeuwenhoek, 2004; 86: 33
[22] Wang L W, Du C W, Liu Z Y, Zeng X X, Li X G. Acta Metall Sin, 2011; 47: 1227
(王力伟, 杜翠薇, 刘智勇, 曾笑笑, 李晓刚. 金属学报, 2011; 47: 1227)
[23] Stratmann M, Streckel H, Bunsen B. Phys Chem, 1988; 92: 1244
[24] Sun M, Xiao K, Dong C F, Li X G, Zhong P. Acta Metall Sin, 2011; 47: 442
(孙敏, 肖葵, 董超芳, 李晓刚, 钟平. 金属学报, 2011; 47: 442)
[25] Ambat R, Mφller P. Corros Sci, 2007; 49: 2866
[26] Trethewey K P, Chamberlain J. Corrosion for Science and Engineering.Beijing: World Publishing Corporation, 2000: 84
