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HOT COMPRESSION DEFORMATION BEHAVIOR OF Mg–Zn–Al–(Y) ALLOYS REINFORCED WITH QUASICRYSTAL |
TONG Jian 1,2, HUANG Hua 1,2, YUAN Guangyin 1,2, DING Wenjiang 1,2 |
1. Light Alloy Net Forming National Engineering Research Center, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240
2. The State Key Laboratory of Metal Matrix Composite, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240 |
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Cite this article:
TONG Jian HUANG Hua YUAN Guangyin DING Wenjiang. HOT COMPRESSION DEFORMATION BEHAVIOR OF Mg–Zn–Al–(Y) ALLOYS REINFORCED WITH QUASICRYSTAL. Acta Metall Sin, 2011, 47(12): 1520-1526.
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Abstract Quasicrystal phase offers a good combination of strength and ductility due to the strong interface between the quasicrystal phase and the Mg–matrix. Hot compression tests of Mg–Zn–Al–(Y) based alloys reinforced with quasicrystal were performed on Gleeble–1500 thermal simulation machine at a constant deformation temperature of 230℃ and strain rates ranged from 0.0015 s−1 to 1.5 s−1. Microstructure evolution of hot–compressed Mg–Zn–Al–(Y) alloys and the relationship between flow stress and strain rate were studied. XRD and SAED results show that the microstructures of as–cast Mg–8Zn–4Al (ZA84) andMg–8Zn–4Al–0.5Y (ZAY8405) are composed of icosahedral quasicrystal phase and α-Mg matrix. The quasicrystals in ZA84 and ZAY8405 alloys have a stoichiometric composition of Mg38Zn43Al19 and Mg51Zn30Al19 respectively. Dynamic recrystalization (DRX) take place during hot compression and the flow stress increases with increase of strain rate at constant compression temperature, which can be represented by the Power Exponential Equation. Deformation twinning and dynamic recrystalization are easier to take place in ZAY8405 alloys due to the refined and dispersed quasicrystal phase with Y addition.
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Received: 17 June 2011
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Fund: Supported by National Natural Science Foundation of China (No.51174136), Specialized Research Fund for the Doctoral Program of Higher Education of China (No.20100073110004) and Science and Technology Commission of Shanghai Municipality (No.10JC1407400) |
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