超精细导电图案的制备是推动电子器件向微型化、柔性化和集成化方向发展的关键技术，对新一代微电子、光电子及柔性器件的创新突破具有不可替代的关键价值。激光诱导转移(LIT)技术凭借其高精度、非接触、材料适应性强的独特优势，大幅提升了超精细图案的分辨率和跨材料兼容能力。近年来，围绕LIT技术的研究在机理探索、工艺优化及应用拓展等方面取得了显著进展，但目前关于“工艺参数-转移机理-高性能应用”之间的内在关联仍缺乏系统性解构，制约了该技术从实验室研发向工业级应用的转化。鉴于此，本文首先回顾了LIT技术从概念提出到多领域应用的发展历程，介绍了LIT技术的转移过程及其在超精细导电图案制造中的优势；进而深入解析了以热效应为主导和以动量传递为核心的两类转移机制，并讨论了材料特性、激光参数和供体-受体界面间距等关键工艺参数对超精细导电图案质量的影响规律。在此基础上，对比分析了单次脉冲转移、多次脉冲叠加转移及复合工艺集成等多种技术路径的特性差异与适用场景。最后，系统总结了基于LIT技术制备的超精细导电图案在微电子电路修复、高性能传感器、柔性可穿戴电子及电池制造等领域的典型应用案例。

The fabrication of ultrafine conductive patterns serves as a core enabling technology propelling the evolution of electronic devices toward miniaturization, flexibility, and high-density integration. Driven by the rapid development of emerging fields such as Internet of Things terminals, flexible wearable electronics, and microenergy devices, the demand for electronic devices in terms of pattern linewidth precision, cross-substrate compatibility, and complex structure adaptability continues to escalate. However, traditional fabrication techniques face inherent bottlenecks in balancing precision control, flexible adaptability, and cost-effective fabrication. Laser-induced transfer (LIT) technology, leveraging its unique advantages of high precision, noncontact processing, and broad material compatibility, has remarkably improved the resolution of ultrafine patterns and expanded cross-material adaptability. This technology provides an innovative technical solution for addressing traditional process bottlenecks in this domain. In recent years, LIT-related research has achieved substantial advancements in mechanistic elucidation, process optimization, and application extension. Nevertheless, a systematic review synthesizing its key progress and evolving trends is still lacking. Accordingly, this review systematically summarizes the current research status and future development directions of LIT technology for the fabrication of ultrafine conductive patterns. First, it traces the technological evolution of LIT from conceptual initiation to multifield practical applications, elaborating on the core transfer process of LIT and its inherent advantages in ultrafine conductive pattern fabrication. It subsequently delves into two major transfer mechanisms, namely, thermally dominated and momentum-transfer-driven mechanisms and systematically discusses the regulatory effects of critical process parameters (e.g., material intrinsic properties, laser process parameters, and the donor-receiver interface distance) on the quality of ultrafine conductive patterns. On this basis, this review conducts a comparative analysis of the performance characteristics and suitable application scenarios of multiple technical implementation routes, such as single-pulse transfer, multipulse superposition transfer, and integrated composite processes. Finally, this review systematically summarizes the typical application cases of LIT-fabricated ultrafine conductive patterns in fields including microelectronic circuit repair, high-performance sensor fabrication, flexible wearable electronics, and battery manufacturing.