添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制
收稿日期: 2025-05-27
修回日期: 2026-01-08
网络出版日期: 2026-01-15
基金资助
国家自然科学基金项目(U2341271);国家自然科学基金项目(52104385);陕西省科技创新团队项目(2025RS-CXTD-020);陕西省青年科技新星项目(2025ZC-KJXX-33);陕西省重点研发计划项目(2023GXLH-037);航空科学基金项目(202400070T6001)
Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer
Received date: 2025-05-27
Revised date: 2026-01-08
Online published: 2026-01-15
Supported by
National Natural Science Foundation of China(U2341271);National Natural Science Foundation of China(52104385);Innovation Research team of Shaanxi(2025RS-CXTD-020);Distinguished Young Scholars of Shaanxi Province(2025ZC-KJXX-33);Key Research and Development Projects of Shaanxi Province(2023GXLH-037);Foundation of Aviation Science(202400070T6001)
铜合金/钛合金双金属材料能够充分发挥铜合金与钛合金的优异性能，具有重要的工程应用价值。然而，高界面强度铜合金/钛合金双金属材料的可控制备面临着巨大的挑战。本工作分别采用添加Ag箔和电沉积Ag层制备了高界面强度QAl10-5-5/TC6双金属，表征并测试了双金属界面的组织和力学性能，阐明了双金属界面的强化机制。结果表明，QAl10-5-5/Ag箔/TC6双金属界面强度在连接温度为850 ℃时达到最大值(200 MPa)；电沉积Ag层的细晶组织促进了QAl10-5-5/TC6双金属在较低的连接温度下形成冶金结合，使得界面强度在连接温度为835 ℃时达到最大值(217 MPa)。电沉积Ag层制备的QAl10-5-5/TC6双金属TC6合金侧形成了由厚度约为1 μm的TiAlCu2反应层以及亚微米尺度的Ti2Cu相和Ti3Al相组成的“影响区”，其中Ti3Al相与基体α相形成了半共格界面。基于强化理论分析发现，细晶强化与析出强化协同提升了QAl10-5-5/TC6双金属TC6合金侧“影响区”的力学性能。
孙利星 , 薛航宇 , 梁淑华 , 杨倩 , 姜琪 , 邹军涛 . 添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制[J]. 金属学报, 2026 , 62(8) : 1454 -1466 . DOI: 10.11900/0412.1961.2025.00144
Structural-functional integrated Cu-alloy/Ti-alloy bimetals combine the advantageous properties of both constituents and therefore exhibit considerable potential for multifunctional applications. However, controlling the interfacial microstructure and achieving sufficient interfacial strength remain significant challenges in Cu-alloy/Ti-alloy systems. This study investigates the evolution of the interfacial microstructure, the ordering behavior of interfacial intermetallic compounds (IMCs), and the relationship between interfacial structure and mechanical performance, aiming to clarify the formation pathway of IMCs and its effect on the interface strength of Cu-alloy/Ti-alloy bimetals. QAl10-5-5/TC6 bimetals were fabricated via diffusion bonding using Ag interlayer (adding Ag foil as interlayer or electrodeposited Ag interlayer on QAl10-5-5 alloy). The resulting interfacial microstructures and shear strengths were systematically characterized, and the corresponding strengthening mechanism was clarified. For the QAl10-5-5/Ag foil/TC6 bimetals, the interfacial strength reached a maximum of 200 MPa at a bonding temperature of 850 oC. Meanwhile, for the Ag layer deposited QAl10-5-5/TC6 bimetals, the fine-grained structure of the electrodeposited Ag layer promoted metallurgical bonding, and the QAl10-5-5/TC6 bimetals achieved maximum interfacial strength of 217 MPa at a bonding temperature of 835 oC. Moreover, an “affected zone” formed on the TC6 alloy side of Ag layer deposited QAl10-5-5/TC6 bimetals, consisting of a TiAlCu2 reaction layer with a thickness of ~1 μm, and submicron scale Ti2Cu and Ti3Al phases, in which a semi-coherent interface occurred between Ti3Al and α-Ti. Theoretical strengthening analysis of Ag layer deposited QAl10-5-5/TC6 bimetal revealed that the grain refinement strengthening and precipitation strengthening enhanced the property of the “affected zone” on the TC6 alloy side.
Key words： Cu alloy; Ti alloy; bimetal; intermetallic compounds; interface strengthening
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