名家经典

金属材料强度-塑性及强度-电导率定量关系

  • 张哲峰 ,
  • 侯嘉鹏 ,
  • 刘睿 ,
  • 李孝滔 ,
  • 张振军 ,
  • 张鹏
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  • 中国科学院金属研究所 沈阳材料科学国家研究中心 沈阳 110016
张哲峰,男,1970年生,研究员,博士
张哲峰,zhfzhang@imr.ac.cn,主要从事金属材料强韧化机制、疲劳与断裂理论及材料、构件抗疲劳制造研究

收稿日期: 2025-08-25

  修回日期: 2025-10-04

  网络出版日期: 2025-11-03

基金资助

国家自然科学基金项目(52321001);国家自然科学基金项目(52130002);国家自然科学基金项目(52322105);国家自然科学基金项目(52571160);国家自然科学基金项目(52401122);中国科学院战略先导科技专项项目(XDB1420000)

Quantitative Relationships Between the Strength-Plasticity and Strength-Electrical Conductivity of Metallic Materials

  • ZHANG Zhefeng ,
  • HOU Jiapeng ,
  • LIU Rui ,
  • LI Xiaotao ,
  • ZHANG Zhenjun ,
  • ZHANG Peng
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  • Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
ZHANG Zhefeng, professor, Tel: (024)23971043, E-mail: zhfzhang@imr.ac.cn

Received date: 2025-08-25

  Revised date: 2025-10-04

  Online published: 2025-11-03

Supported by

National Natural Science Foundation of China(52321001);National Natural Science Foundation of China(52130002);National Natural Science Foundation of China(52322105);National Natural Science Foundation of China(52571160);National Natural Science Foundation of China(52401122);Strategic Priority Research Program of the Chinese Academy of Sciences(XDB1420000)

摘要

金属材料强度-塑性、强度-电导率之间普遍存在相互制约关系。本文基于提出的独立位错空间模型,阐明了金属材料强度-塑性制约关系的本质,并受独立位错空间尺寸所控制,揭示了金属类型、合金成分、变形温度和应变速率是调控独立位错空间尺寸的关键因素,而微观组织或晶粒尺寸分布对其影响有限。这一发现解释了在固定金属类型、合金成分及变形参数条件下,仅通过优化微观组织或晶粒尺寸难以实现强度与塑性同步提升的根本原因。基于单相合金中位错塞积的晶粒尺寸依赖性,建立了拉伸强度-均匀延伸率权衡模型,并在多种金属材料体系中得到实验验证。针对金属导线,通过分析晶界、取向和纳米析出相对位错塞积和电子散射的差异化作用,提出了金属导线高强-高导三原则:细长晶粒、硬取向织构和纳米相调控。基于上述原则,构建了强度-电导率定量关系模型,阐释了金属导线强度与电导率呈现协同提升、相互制约等典型现象的内在机制。最终,依据高强-高导三原则设计制备出突破现有强度-电导率制约关系的高性能导线。建立的金属材料强度-塑性、强度-电导率定量关系模型,可以高效指导金属材料选材、成分设计及微观组织工艺控制,保证构件服役安全性。

本文引用格式

张哲峰 , 侯嘉鹏 , 刘睿 , 李孝滔 , 张振军 , 张鹏 . 金属材料强度-塑性及强度-电导率定量关系[J]. 金属学报, 2026 , 62(2) : 253 -262 . DOI: 10.11900/0412.1961.2025.00248

Abstract

A general mutual constraint exists between the strength-plasticity and the strength-electrical conductivity of metallic materials. This study proposes an independent space model of dislocation motion to show that the trade-off relation between the strength and plasticity of metallic materials is controlled by the independent spatial size of dislocation motion. Furthermore, the model is used to show that the metal type, alloy composition, deformation temperature, and strain rate are the key factors regulating the spatial size, whereas the microstructure or grain size distribution has a limited influence on it. This finding explains why it is difficult to simultaneously improve strength and plasticity through microstructure or grain size optimization when the metal type, composition, and deformation parameters are fixed. Further, based on the grain size dependence of dislocation piling-up in single-phase alloys, a quantitative trade-off model between tensile strength and uniform elongation is established and experimentally verified in a variety of metal alloy systems. Three high-strength and high-electrical conductivity principles for metal wires are proposed by analyzing the differentiated effects of grain boundaries, orientation, and nanoprecipitation relative dislocation piling-up and electron scattering: elongated grains, strong texture orientation, and nanoprecipitate regulation. Based on the three principles, a quantitative model describing the relationship between strength and electrical conductivity is constructed, and the underlying mechanisms of typical phenomena, such as the synergistic improvement and mutual constraint of strength and electrical conductivity in different metal wires, are systematically explained. Finally, high-performance conductors based on three principles, with performance that breaks through the existing strength-electrical conductivity constraint, are developed. Establishing quantitative models describing the relationships between strength and plasticity, as well as between the strength and electrical conductivity of metallic materials, can efficiently guide material selection, composition design, and microstructure process control, ensuring the service safety of components.

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