计算了GH536高温合金选区激光熔化(SLM)过程中熔池区域的温度场变化和凝固后残余应力分布。计算采用复合Gauss热源研究激光光学穿透深度的影响规律,通过研究材料属性随温度的变化关系实现粉层、熔池及固态金属的转化。实验结果表明,Gauss热源模型能够较好地模拟SLM过程中的温度场分布以及凝固后的残余应力。模拟结果显示,随着激光功率的增大,熔池宽度、深度和长度均相应增大,凝固速率减小;随着扫描速率增大,熔池宽度和深度减小,长度不变,凝固速率增大。计算结果表明,单层选区激光熔化的零件表面存在较大的拉应力,随着深度增大,拉应力迅速减小转为压应力。

In the aerospace industry, due to the increasing hardness and tensile strength of nickel-based superalloys, the traditional manufacturing methods are difficult to produce, which limits the freedom of part design and process. Selective laser melting (SLM) has great potential in this field with its additive manufacturing concept and full melting during the process. Although the dense part can be easily obtained in SLM, the residual stresses and micro-cracks in the machining process still affect the dimensional accuracy and reliability of the parts. In SLM process, rapid and complex changes of temperature and stress are observed in the vicinity of the molten pool. Understanding these changes will help to improve the quality of the process. In this work, a finite element model (FEM) is established to calculate the temperature and residual stress distribution near the weld pool during the SLM of Hastelloy X superalloy, The model uses a composite Gauss heat source to consider the influence of optical penetration depth, and implements the transformation of powder, molten pool and solid metal by changing the material properties with temperature. Comparison with the test results shows that the model can simulate the distribution of temperature field and the residual stress in SLM process well. The simulation results show that with the increase of laser power, the width, length and depth of melting pool were enlarged, the cooling rate decreases; with the increase of the scanning speed, the width and depth of melting pool decreases, the length remained unchanged, the cooling rate increase. After cooling, there is a large tensile stress on the surface of the model. As the depth increases, the tensile stress decreases rapidly and eventually becomes compressive stress.