采用Zr箔/Cu箔/Zr箔中间层对Ti(C, N)-Al₂O₃陶瓷基复合材料进行部分瞬间液相扩散连接实验, 研究保温时间对元素扩散及界面反应产物的影响, 探讨了制约接头室温强度的因素, 对比分析了在部分瞬间液相扩散连接过程中, 辅助脉冲电流对元素扩散及接头强度的作用机制. 结果表明, 预置Zr箔/Cu箔/Zr箔中间层通过部分瞬间液相扩散连接, 在加热温度950 ℃, 保温时间15~30 min条件下接头强度达到最大值. 保温时间过短, 活性元素Zr削弱基体强度, 保温时间过长, Zr与Cu在界面生成金属间化合物降低了接头的强度. 扩散焊过程中施加辅助脉冲电流能够有效缓解接头的残余应力, 防止裂纹在脆性基体材料中扩展; 但是同时促进了界面处的反应进程, 显著提高了界面处Cu-Zr金属间化合物的形成速度, 使得界面易成为接头的薄弱环节.

The partially transient liquid phase-diffusion bonding (PTLP-DB) on Ti(C, N)-Al₂O₃ ceramic matrix composites (CMC) was studied using the Zr foil/Cu foil/Zr foil sanwich as an interlayer. Effect of holding time during PTLP-DB on the element diffusion and reacted products at the interface was analyzed and the affected factors on the joint strength during PTLP-DB were explored. The effect of auxiliary pulse current during PTLP-DB between CMC on element diffusion at the interface and joint strength and its mechanism were also studied. The results showed that the optimum holding times were 15~30 min during PTLP-DB on CMC at 950 ℃. With a shorter holding time, the joint strength decreased due to the existance of unreacted Zr elements at the interface, while with a longer holding time, the joint strength decreased due to the overgrowth of CuZr intermetallics at the interface. With the auxiliary pulse current during PTLP-DB, the residual stress at the interface was greatly decreased, which inhibited the propagation of crack into the base materials. While, the auxiliary pulse current can promote the reaction between Cu and Zr and the formation of Zr-Cu intermetallics at the interface, which produced a weaked interface in the joints.