焊锡接点IMC层微结构演化与力学行为

安彤; 秦飞; 王晓亮

doi:10.3724/SP.J.1037.2013.00186

金属学报 >

2013 , Vol. 49 >Issue 9: 1137 - 1142

DOI: https://doi.org/10.3724/SP.J.1037.2013.00186

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焊锡接点IMC层微结构演化与力学行为

安彤 ,
秦飞 ,
王晓亮

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北京工业大学机械工程与应用电子技术学院先进电子封装技术与可靠性实验室, 北京 100124

安彤, 女, 1983年生, 博士生

收稿日期: 2013-04-15

修回日期: 2013-06-28

网络出版日期: 2013-09-11

基金资助

国家自然科学基金项目10972012和北京工业大学博士生创新基金资助

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MICROSTRUCTURE EVOLUTION AND MECHANICAL BEHAVIOR OF INTERMETALLIC COMPOUNDS IN SOLDER JOINT

AN Tong ,
QIN Fei ,
WANG Xiaoliang

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Laboratory of Advanced Electronic Packaging Technology & Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124

Received date: 2013-04-15

Revised date: 2013-06-28

Online published: 2013-09-11

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摘要

研究了150℃等温时效过程中无Pb焊料Sn3.0Ag0.5Cu与Cu基体间金属间化合物(intermetallic compound, IMC)的生长速率及形貌演化, 以及IMC的生长演化对焊锡接点力学性能的影响.结果表明, IMC厚度与等温时效时间的平方根呈线性增长关系, 随着等温时效时间的增加,IMC与焊料界面由初始的凹凸不平的扇贝状形貌逐渐变得平坦.IMC厚度和界面粗糙度共同影响焊锡接点的拉伸强度和断裂模式, 随着时效时间的增加, IMC变厚, 同时焊料与IMC界面变平坦,断裂模式由焊料内部的韧性断裂逐渐转变为IMC层内部的脆性断裂.

关键词： 焊锡接点; 金属间化合物; 力学行为; 拉伸强度; 断裂模式

本文引用格式

安彤 , 秦飞 , 王晓亮 . 焊锡接点IMC层微结构演化与力学行为[J]. 金属学报, 2013 , 49(9) : 1137 -1142 . DOI: 10.3724/SP.J.1037.2013.00186

Abstract

Thickness and roughness evolution of the intermetallic compounds (IMC) layer between Sn3.0Ag0.5Cu and Cu substrate are examined under various isothermal aging times at 150℃.The effect of the microstructure evolution of the IMC on the mechanical behavior of solder joints is experimentally investigated. The results show that the growth of the IMC follows the Fick's law that predicts the total mean thickness increases linearly with the square root of the aging time. With the increase of the isothermal aging time, the initial scallop morphology of the solder/IMC interface changes to a more planar type. Both the thickness and roughness of the IMC layer affect the tensile strength and fracture mode of the solder joints. The tensile strength decreases with the increase of either the IMC thickness or the solder/IMC interfacial roughness. With the increase of the isothermal aging time, the IMC thickness increases and the solder/IMC interfacial roughness decreases, and the fracture mode migrates from ductile fracture in bulk solder to brittle fracture in the IMC layer.

Key words： solder joint; intermetallic compound; mechanical behavior; tensile strength; fracture mode

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