混装BGA器件高温老化实验焊点微观组织研究
收稿日期: 2012-12-20
修回日期: 2013-05-25
网络出版日期: 2013-07-11
基金资助
国家自然科学基金资助项目51075103
RESEARCH ON MICROSTRUCTURE OF Pb-FREE BGA SOLDER JOINT ASSEMBLED WITH Sn-Pb SOLDER DURING ISOTHERMAL AGING
Received date: 2012-12-20
Revised date: 2013-05-25
Online published: 2013-07-11
采用有Pb焊料对无Pb焊点球栅阵列(BGA）塑封器件进行焊接,选用再流焊工艺对器件进行混装焊接. 对混装再流焊BGA器件分别进行4, 9,16和25 d的高温老化实验, 在老化实验前后不同阶段,使用精密电阻仪对混装BGA器件进行电性能测试, 没有发现器件的电性能失效.利用SEM对焊点微观组织的分析发现, 混装焊点印制电路板(PCB)侧金属间化合物(IMC)成分为Cu3Sn和Cu6Sn5,BGA焊盘侧IMC成分为Ni-Cu-Sn三元化合物. 对焊点两侧的IMC进行厚度测量,结果表明, 随老化时间延长两侧的IMC厚度都增大,PCB一侧IMC生长速率明显高于BGA焊盘一侧. 此外,有一些焊点内部和界面处出现了富Pb相聚集、IMC破裂、界面裂纹以及空洞等可靠性隐患.
杭春进 , 田艳红 , 赵鑫 , 王春青 . 混装BGA器件高温老化实验焊点微观组织研究[J]. 金属学报, 2013 , 49(7) : 831 -837 . DOI: 10.3724/SP.J.1037.2012.00759
The Pb-free plastic encapsulated ball grid array (BGA) packages have been assembled to printed-circuit boards (PCBs) with SnPb solder material using reflowing process. Isothermal aging with 4, 9, 16 and 25 d was applied to the assembled packages and the microstructures of the solder joints in the BGA packages were observed using SEM. The electrical performance test was conducted before and after different periods of isothermal aging. The result showed that there were no failure in the BGA devices. It was found that intermetallic compounds (IMCs) in the PCB substrate side were Cu3Sn and Cu6Sn5 while Ni-Cu-Sn ternary compounds were in BGA substrate side. The thicknesses of IMCs on both sides increased with the time of isothermal aging. The IMC growth rate at PCB side was significantly greater than that at BGA substrate side. The aggregation of Pb-rich phase, cracks along substrate, broken IMCs, and voids, which have negative effects on the joints reliability, were observed in a few solder joints after long-term isothermal aging process.
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