Fe-Ni新型UBM薄膜的晶圆电镀工艺研究
收稿日期: 2012-04-25
修回日期: 2012-07-20
网络出版日期: 2012-10-11
基金资助
国家科技重大专项项目2011ZX02602, 国家重点基础研究发展计划项目2010CB631006和沈阳市科技项目F11-264-1-65资助
WAFER LEVEL ELECTRODEPOSION OF Fe–Ni NOVEL UBM FILMS
Received date: 2012-04-25
Revised date: 2012-07-20
Online published: 2012-10-11
Supported by
Supported by Major National Science and Technology Program of China (No.2011ZX02602), National Basic Research Program of China (No.2010CB631006) and Shenyang Science and Technology Project (No.F11–264–1–65)
利用改良型硫酸盐--氯化物镀液体系, 进行了晶圆级Fe-Ni凸点下金属层(UBM)电镀工艺的开发研究. 研究了镀液中Fe2+含量、电镀温度及电流密度对镀层成分的影响规律, 得到了特定工艺条件下镀层成分控制的完整曲线;测量了不同电镀时间和不同电流密度下的镀层生长速率, 为实际生产中控制UBM镀层的厚度提供了依据; 利用XRD和TEM对镀层的晶体结构及微观形貌进行了表征; 利用滴定、等离子体发射光谱(ICP)等手段, 对镀液在生产及静置条件下主盐离子浓度的变化趋势进行了监测, 测定了抗坏血酸在镀液体系中与Fe3+的反应能力, 提出了镀液的日常维护、保存、调控方案以及Fe3+的抑制方案.
关键词： Fe-Ni合金; 电镀; 凸点下金属层(UBM); 晶圆级封装
张昊 吴迪 张黎 段珍珍 赖志明 刘志权 . Fe-Ni新型UBM薄膜的晶圆电镀工艺研究[J]. 金属学报, 2012 , 48(10) : 1273 -1280 . DOI: 10.3724/SP.J.1037.2012.00229
Using customized wafer electroplating system, the electrodeposition process of Fe–Ni under bump metallization (UBM) thin film has been developed by modified Watts bath. The major factors which can affect the Fe content in the final UBM films, including the concentration of Fe2+, electrodeposition temperature and current density, were investigated systematically. The growth rate of Fe–Ni film under different electroplating conditions was measured in order to provide a reference for actual production. The microstructure and morphology of obtained Fe–Ni films were characterized by XRD and TEM. Multiple kinds of analytical methods including titration and inductive coupled plasma emission spectrometer (ICP) were used to monitor the content change of bath component under working or storage conditions. Regulations were put forward to maintain the bath daily including the keeping of the main salt content and the inhibition of Fe3+ concentration.
[1] O’Donnell T, Wang N N, Kulkarni S, Meere R, Rhen F M F, Roy S, O’Mathuna S C. J Magn Magn Mater, 2010; 322: 1690
[2] Esmaili S, Bahrololoom M E, Kavanagh K L. Mater Charact, 2011; 62: 204
[3] Leith S D, Ramli S, Schwartz D T. J Electrochem Soc, 1999; 146: 1431
[4] Koo B, Yoo B. Surf Coat Technol, 2010; 205: 740
[5] Zeng K, Tu K N. Mater Sci Eng, 2002; R38: 55
[6] Yan Y F, Wang W L, Chen G F. Pb–free Solders in SMT. Beijing: Publishing House of Electronics Industry, 2010: 102
(闫焉服, 王文利, 陈冠方. 电子装联中的无铅焊料. 北京: 电子工业出版社, 2010: 102)
[7] Dariavach N, Callahan P, Liang J, Fournelle R. J Electron Mater, 2006; 35: 1581
[8] Zhu Q S, Guo J J, Shang P J, Wang Z G, Shang J K. Adv Eng Mater, 2010; 12: 497
[9] Guo J J, Zhang L, Xian A P, Shang J K. J Mater Sci Technol, 2007; 23: 811
[10] Zhang H, Zhang L, Duan Z Z, Liu Z Q. Sci J Microelectron, 2012; 2: 13
(张昊, 张黎, 段珍珍, 刘志权. 微电子期刊, 2012; 2: 13)
[11] Huang Z X, Wu C S. Theory of Electroplating. Beijing: China Machine Press, 1982: 5
(黄子勋, 吴纯素. 电镀理论. 北京:机械工业出版社, 1982: 5)
[12] Chen T Y. Electroplating of Nickel Alloy. Beijing: Chemical Industry Press, 2007: 18
(陈天玉. 镀镍合金.北京: 化学工业出版社, 2007: 18)
[13] Han P X. Environ Sci Technol, 2006; 29: 42
(韩平学. 环境科学与技术, 2006; 29: 42)
[14] Chen T Y. Trouble Settlement and Actual Samples of Nickel Plating. Beijing: Chemical Industry Press, 2010: 19
(陈天玉. 镀镍故障处理及实例. 北京: 化学工业出版社, 2010: 19)
[15] Li P, Lu L, Liu T C, Sun K, Lu Z C, Lu Y P. J Funct Mater, 2001; 38: 32
(李鹏, 卢琳, 刘天成, 孙克, 卢志超, 卢燕平. 功能材料, 2001; 38: 32)
[16] Liu T C, Lu Z C, Li D R, Lu Y P, Sun K, Zhou S X. J Univ Sci Technol Beijing, 2006; 28: 298
(刘天成, 卢志超, 李德仁, 卢燕平, 孙克, 周少雄. 北京科技大学学报, 2006; 28: 298)
[17] Han Y, Wang P, Wang B Y, Qin Q X. Plat Finish, 1997; 19: 8
(韩勇, 王萍, 王宝玉, 覃奇贤. 电镀与精饰, 1997; 19: 8)
[18] Tabakovic I, Inturi V, Thurn J, Kief M. Electrochim Acta, 2010; 55: 6749
[19] Su X H, Qiang C W. Bull Mater Sci, 2012; 35: 183
[20] Rousse C, Fricoteaux P. J Mater Sci, 2011; 46: 6046
[21] Grimmett D L, Schwartz M, Nobe K. J Electrochem Soc, 1993; 140: 973
[22] Kieling V C. Surf Coat Technol, 1997; 96: 135
[23] Li P, Liu T C, Sun K, Lu Y P, Lu Z C. Electroplat Finish, 2005; 24: 6
(李 鹏, 刘天成, 孙克, 卢燕平, 卢志超. 电镀与涂饰, 2005; 24: 6)
[24] Tabakovic I, Inturi V, Thurn J, Kief M. Electrochim Acta, 2011; 56: 2616
[25] Chen T Y. Technological Foundation of Nickel Plating. Beijing: Chemical Industry Press, 2011: 37
(陈天玉. 镀镍工艺基础. 北京: 化学工业出版社, 2011: 37)
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