论文

高结晶度CrN纳米粒子掺杂的DLC薄膜的显微结构及力学性能

  • 吴忠振 ,
  • 田修波 ,
  • 程思达 ,
  • 巩春志 ,
  • 杨士勤
展开
  • 哈尔滨工业大学先进焊接与连接国家重点实验室, 哈尔滨 150001
吴忠振, 男, 1984年生, 博士生

收稿日期: 2011-08-08

  修回日期: 2011-11-17

  网络出版日期: 2012-03-11

基金资助

国家自然科学基金项目10975041和10905013资助

MICROSTRUCTURE AND MECHANICAL PROPERTIES OF DLC FILMS DOPED WITH HIGH CRYSTALLINITY CrN NANOPARTICLES

  • WU Zhong-Zhen ,
  • TIAN Xiu-Bei ,
  • CHENG Sai-Ta ,
  • GONG Chun-Zhi ,
  • YANG Shi-Qi
Expand
  • State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001

Received date: 2011-08-08

  Revised date: 2011-11-17

  Online published: 2012-03-11

Supported by

Supported by National Natural Science Foundation of China (Nos.10975041 and 10905013)

摘要

采用高功率脉冲磁控放电等离子体注入与沉积(HPPMS-PIID)和常规直流磁控溅射复合的方法设计制备了包含高结晶度的CrN纳米粒子的DLC薄膜, 并对不同C靶电流时制备的CrN-DLC薄膜的形貌、结构及性能进行了研究. 结果表明, 随C靶电流的增加, 薄膜中的含C量增加, 在较高的C含量时形成了明显的DLC薄膜特征, 掺杂相主要成分为高度200择优取向的CrN纳米晶, 其最小晶粒尺寸为42.39 nm. 薄膜中的C主要以C-sp2, C-sp3和CN-sp3键的形式存在, sp3键的总含量为sp2总含量的44.8%. 所制备的薄膜具有很好的膜基结合力(临界载荷Lc=66.8 N)和较高的纳米硬度(最高达24.3 GPa).

本文引用格式

吴忠振 , 田修波 , 程思达 , 巩春志 , 杨士勤 . 高结晶度CrN纳米粒子掺杂的DLC薄膜的显微结构及力学性能[J]. 金属学报, 2012 , 48(3) : 283 -288 . DOI: 10.3724/SP.J.1037.2011.00512

Abstract

DLC films with dispersed high crystallinity CrN nanoparticles were prepared by high power pulsed magnetron discharge plasma ion implantation & deposition (HPPMS-PIID) combined with DC magnetron sputtering (DCMS). The surface morphology, structure and properties of CrN--DLC films with the different currents of C target were studied. The results show that the C content increases as the raise of the current of the C target and clear characteristics of DLC films are found at a higher C content. CrN doped in DLC exists as nanoparticles with highly 200 preferred orientation, and the smallest size of the CrN grains is 42.39 nm. The C1s peak primarily consists of the three peaks that correspond to C-sp2, C-sp3 and CN-sp3, and the ratio of total sp3 to sp2 is 44.8%. Excellent adhesion between film and substrate with critical load of 66.8 N and high nanohardness up to 24.3 GPa are achieved due to highly energetic ion bombardment and implantation in HPPMS-PIID.

参考文献

[1] Liang F, Yan X J. Acta Phys Sin, 1999; 48: 1095

(梁风, 严学俭. 物理学报, 1999; 48: 1095)

[2] Grill A. Diamond Relat Mater, 1999; 8: 428

[3] Chen G H, Yan S G, Zhang F Q. Acta Phys Sin, 1992; 41: 500

(陈光华, 阎少光, 张仿清. 物理学报, 1992; 41: 500)

[4] Schwarz C, Heeg J, Rosenberg M, Wienecke M. Diamond Relat Mater, 2008; 17: 1685

[5] Takeno T, Hoshi Y, Miki H, Takagi T. Diamond Relat Mater, 2008; 17: 1669

[6] Gu K M, Tang J N, Li J Q, Yang Q P. J Shenzhen Univ Sci Eng, 2007; 24: 159

(谷坤明, 汤皎宁, 李均钦, 杨钦鹏. 深圳大学学报理工版, 2007; 24: 159)

[7] Nie C Y, Zhang B Y, Xie H M. Acta Metall Sin, 2007; 43: 1207

(聂朝胤, 张碧云, 谢红梅. 金属学报, 2007; 43: 1207)

[8] Veprek S, Argon A S. Surf Coat Technol, 2001; 146–147: 175

[9] Mourae Silva C W, Branco J R T, Cavaleiro A. Thin Solid Films, 2006; 515: 1063

[10] Baba K, Hatada R, Tanaka Y. Surf Coat Technol, 2007; 19–20: 8362

[11] Tian X B, Wu Z Z, Gong C Z, Yang S Q. Chin Pat, 201010213894.4, 2010

(田修波, 吴忠振, 巩春志, 杨士勤. 中国专利, 201010213894.4, 2010)

[12] Kouznetsov V, Mac´ak K, Schneider J M, Helmersson U, Petrov I. Surf Coat Technol, 1999; 122: 290

[13] Helmersson U, Lattemann M, Bohlmark J, Ehiasarian A P, Gudmundsson J T. Thin Solid Films, 2006; 513: 1

[14] Wu Z Z, Tian X B, Shi J W, Yang S Q, Chu P K. Rev Sci Inst, 2011; 82: 033511

[15] Wu Z Z, Tian X B, Wang Z M, Gong C Z, Yang S Q. Chin J Vac Sci Technol, 2011; 31: 1

(吴忠振, 田修波, 王泽明, 巩春志, 杨士勤. 真空科学与技术学报, 2011; 31: 1)

[16] Li G, Xia L F, Ma X X, Sun Y, Zhan Z J. Acta Metall Sin (Eng Lett), 1999; 12: 551

[17] Ji H B, Xia L F, Ma X X, Sun Y, Sun M R. Acta Metall Sin (Eng Lett), 2000; 13: 967

[18] Wu Z Z. Master Dissertation, Harbin Institute of technology, 2008

(吴忠振. 哈尔滨工业大学硕士学位论文, 2008)

[19] Tian X B, Wu Z Z, Shi J W, Li X P, Gong C Z, Yang S Q. Vacuum, 2010; 47: 44

(田修波, 吴忠振, 石经伟, 李希平, 巩春志, 杨士勤. 真空, 2010; 47: 44)

[20] Anders A. Surf Coat Technol, 1997; 93: 158

[21] Martin P J, Bendavid A, Cairney J M, Hoffman M. Surf Coat Technol, 2005; 200: 2228

[22] Ma D Y, Ma S L, Xu K W. Acta Metall Sin, 2004; 40: 1037

(马大衍, 马胜利, 徐可为. 金属学报, 2004; 40: 1037)

[23] Guo Y, Xu B, Wu G Z, Ma S L, Xu K W. Acta Metall Sin, 2007; 43: 159

(郭岩, 徐 彬, 吴贵智, 马胜利, 徐可为. 金属学报, 2007; 43: 159)

[24] Alami J, Sarakinos K, Uslu F, Wuttig M. J Phys D: Appl Phys, 2009; 42: 015304

[25] Vyas A, Shen Y G, Zhou Z F, Li K Y. Compos Sci Technol, 2008; 68: 2922

[26] Shi Y, Long S, Liang F. Appl Surf Sci, 2008; 254: 5861

[27] Yang Y Y, Peng Z J, Fu Z Q, Wu S D, Chen X C, Wang C B. Acta Metall Sin, 2010; 46: 34

(杨义勇, 彭志坚, 付志强, 邬苏东, 陈新春, 王成彪. 金属学报. 2010; 46: 34)

[28] Yang W J, Choa Y–H, Sekino T, Shim K B, Niihara K, Auh K H. Thin Solid Films, 2003; 434: 49

[29] Jiang B L, Hu P F, Li H T. Trans Mater Heat Treat, 2010; 31: 134

(蒋百灵, 胡鹏飞, 李洪涛. 材料热处理学报. 2010; 31: 134)

[30] Niu S C, Yu Z M, Dai M J, Lin S S, Hou H J, Li H W. China Surf Eng, 2007; 20: 34

(牛仕超, 余志明, 代明江, 林松盛, 候惠君, 李洪武. 中国表面工程. 2007; 20: 34)

[31] Veprek S, Niederhofer A, Moto K, Bolom T, Mannling H–D, Nesladek P, Dollinger G, Bergmaier A. Surf Coat Technol, 2000; 133–134: 152

[32] Robertson J. Mater Sci Eng, 2002; R37: 129
文章导航

/