<strong><i>MAX</i></strong> 相表面金属晶须自发生长现象的研究现状与展望

doi:10.11900/0412.1961.2021.00119

金属学报

2022, Vol. 58

Issue (3): 295-310 DOI: 10.11900/0412.1961.2021.00119

综述

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MAX 相表面金属晶须自发生长现象的研究现状与展望

田志华¹, 张培根¹(

), 刘玉爽², 陆成杰¹, 丁健翔³, 孙正明¹(

)

^1.东南大学材料科学与工程学院江苏省先进金属材料高技术研究重点实验室南京 211189
^2.南京工程学院材料科学与工程学院江苏省先进结构材料与应用技术重点实验室南京 211167
^3.安徽工业大学材料科学与工程学院先进金属材料绿色制备与表面技术教育部重点实验室马鞍山 243002

Research Progress and Outlook of Metal Whisker Spontaneous Growth on MAX Phase Substrates

TIAN Zhihua¹, ZHANG Peigen¹(

), LIU Yushuang², LU Chengjie¹, DING Jianxiang³, SUN Zhengming¹(

)

^1.Jiangsu Key Laboratory of Advanced Metallic Materials, School of Materials Science and Engineering, Southeast University, Nanjing 211189, China
^2.Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology, School of Materials Science and Engineering, Nanjing Institute of Technology, Nanjing 211167, China
^3.Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education, School of Materials Science and Engineering, Anhui University of Technology, Ma'anshan 243002, China

引用本文:

田志华, 张培根, 刘玉爽, 陆成杰, 丁健翔, 孙正明. MAX 相表面金属晶须自发生长现象的研究现状与展望[J]. 金属学报, 2022, 58(3): 295-310.
Zhihua TIAN, Peigen ZHANG, Yushuang LIU, Chengjie LU, Jianxiang DING, Zhengming SUN. Research Progress and Outlook of Metal Whisker Spontaneous Growth on MAX Phase Substrates[J]. Acta Metall Sin, 2022, 58(3): 295-310.

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摘要:

以Sn晶须为代表的金属晶须自发生长现象由来已久，电子工业深受其害，但铅添加剂的使用使相关研究一度沉寂。新世纪伊始，“铅毒”迫使人们开发无铅化Sn晶须抑制策略。然而，复杂的影响因素阻碍了对金属晶须自发生长现象的全面认识。近年来，诸多研究表明MAX相基体具有与金属基体相似的晶须自发生长现象，并且晶须的再现性好、孕育期短、生长速率快、种类丰富。因此，将MAX相作为研究晶须自发生长的新平台，有望加快人们对这一普遍现象的全面理解。本文以金属晶须自发生长为背景，结合本课题组相关研究，综述MAX相表面金属晶须自发生长研究工作，从晶须生长的2个基本过程(形核与长大)分析，阐述自发生长机制，并展望MAX相上晶须自发生长的研究方向与潜在应用。

关键词 ：金属晶须, 自发生长, MAX相, 抑制策略, 无铅化, 可靠性

Abstract：

The spontaneous growth of metal whiskers, most notably tin whiskers, has a long history, and the electronics industry has suffered greatly as a result. Pb additive had previously deactivated research on the whiskering phenomenon, but the toxicity of lead alarmed people at the beginning of the century. Nevertheless, intricate conditions involved in the whisker growth research and the multifarious phenomena have hampered the research on this topic; therefore, a comprehensive understanding of the metal whisker growth has been absent. A related whiskering phenomenon on MAX phase substrates has been investigated in recent years, and the occurrence of MAX phase, compared with the whisker growth on metallic substrates, exhibits good repeatability, a short incubation period, a fast growth rate, and rich composition varieties. Therefore, the MAX phase as a new platform of whisker growth investigation is expected to speed up the understanding of the mechanisms related to this phenomenon. Regarding the general background of spontaneous metal whisker growth and our group's current findings, this review summarizes the current status of spontaneous metal whisker growth on MAX phase substrates, discusses and describes the growth mechanism from the two main processes of crystal growth (nucleation and growth), and concludes with a perspective on future research and potential applications of spontaneous whisker growth on the MAX phase substrates.

Key words： metal whisker spontaneous growth MAX phase mitigation strategy lead-free reliability

收稿日期: 2021-03-23

ZTFLH:

TQ174

基金资助:国家重点研发计划项目(2017YFE0301403);国家自然科学基金项目(51731004);江苏省自然科学基金项目(BK20201283)

作者简介: 田志华，男，1995年生，博士生

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图1 MAX相的层状晶体结构Color online(a) 211 phase (b) 312 phase (c) 413 phase

图2 目前已合成MAX相中各组元在元素周期表中的分布[55]

图3 Cr2GaN表面生长的Ga晶须[6](a) all whiskers are pure single-crystalline Ga(b) spiral whisker(c) winding whisker(d) marked increase in density and lengths of whiskers after six months

图4 Cr2GaC中Ga晶须或Ga球被基体“吸回”并形成纳米带[81](a) Ga whiskers appear (b) Ga whiskers disappear(c) Ga spheres appear (d) Ga spheres disappear

图5 晶须生长的氧化-压应力机制及有限元模拟结果[12](a) periodic hexagonal arrangement of Al grains (gray) surrounded by a thin oxide layer (not shown) and Sn (white)(b) plane strain finite element mesh for the analysis of the effect of oxide expansion (SM—soft metal)(c) contours of out-of-plane stress in Sn in MPa

图6 解理面“催化”机制描述的Ga晶须形核示意图[85]

图7 Ti2SnC/120Sn体系中Sn晶须生长的同位素研究结果[82](a) relative proportion of 118Sn to 120Sn under different conditions(b) scheme illustrating the contribution from lattice and excess Sn atoms to whiskers

图8 Sn晶须与Ti2SnC基体界面的微观结构[90](a) TEM image of the interface, and the insets show the corresponding SAED patterns(b) magnified view of the white rectangle area in Fig.8a(c) HRTEM images of the interface, where d represents interplanar spacing, dˉ1 and dˉ2 are the average interplanar spacings of the transition layer in Areas 1 and 2, respectively

图9 Sn晶须在真空、空气气氛下交替培养时的形貌图[89](a) whisker bottom with prismatic features (in vacuum)(b) bottom becomes streaked and the prisms move upwards (in air)

图10 真空环境培养的Sn晶须及对应的形貌模拟结果[90](a, b) quadrangular Sn whisker (c, d) hexagonal Sn whisker

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