金属学报  1989, Vol. 25 Issue (6): 85-90

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Cu与液态Sn的相互作用——兼论润湿曲线的物理意义

张启运;韩万书;刘军钪

北京大学化学系;教授;北京(100871);北京大学;北京大学

INTERACTION BETWEEN Cu AND LIQUID Sn——Also on Physical Meaning of Wetting Curve

ZHANG Oiyun;HAN Wanshu;LIU Junkang Peking University; Beijing ZHANG Qiyun; professor; Department of Chemistry; Peking University 100871

张启运;韩万书;刘军钪. Cu与液态Sn的相互作用——兼论润湿曲线的物理意义[J]. 金属学报, 1989, 25(6): 85-90.
, , . INTERACTION BETWEEN Cu AND LIQUID Sn——Also on Physical Meaning of Wetting Curve[J]. Acta Metall Sin, 1989, 25(6): 85-90.

摘要 参考文献 相关文章 Metrics 全文: PDF(1681 KB)   摘要: 用显微结构方法研究了Cu与液态Sn的相互作用;作出了浸沾时间与Cu溶解扩散的关系图。温度升高至350℃时金属间化合物Cu_6Sn_5的生长有突跃,以羽毛状迅速生长并突破沾Sn层。研究了抑制金属间化合物生长的各种方法。根据上述研究,详细讨论了meniscograph方法所得润湿曲线的物理意义。 关键词 ： Cu_6Sn_5,  溶解扩散,  润湿曲线     Abstract：The interaction between Cu and liquid Sn was studied by microstruc-ture observation. The curve of the dipping time with related to dissolving anddiffusion of Cu in liquid Sn was given. The Cu dissolves rapidly in liquid Sn atthe beginning, then an intermetallic compound, Cu_6Sn_5, forms, and the dissolvingfollows to slow down. At temperature up to 350℃, the feather-like Cu_6Sn_5 is sud-denly growing up and spreads through the dipped Sn layer. The way to inhibitthe growth of the intermetallic compound, Cu_6Sn_5, was also approached. Thus, onthe above mentioned basis, the phyical meaning of the wetting curve traced by themeniscograph wettability tester has been derived as film detaching, Cu dissolvingand Cu_6Sn_5 growing. Key words： Cu    liquid Sn    meniscograph    wettability    wetting curve 收稿日期: 1989-06-18      服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 张启运 韩万书 刘军钪 44.8K 链接本文: https://www.ams.org.cn/CN/      或      https://www.ams.org.cn/CN/Y1989/V25/I6/85 1 Hultgren R, Desal P D, Hawkins D T. Gleiser M, Kelley K K. Selected Values of the Thermodynamic Properties of Binary Alloys, Metals Park, Ohio: American Socity for Metals, 1973: 797 2 Ernests Hedges. Tin and its Alloys, Edward Awnold, London, 1976 3 Davis P E. Warwick M E, Muckett S J. Plat Surf Finish, 1983; 70(8) : 49 4 田中和吉.电子技术,1980;22(7) :12 5 陈定华,钱乙余,方鸿渊,范富华.几种不同线材与镀层间扩散形成的金属间化合物的研究,哈尔滨工业大学科学研究报告,1984 6 Ikuo Okamoto, Tadashi Takemoto, Masami Mizutani, Ikuo Mori. Trans JWRI, 1985; 14(1) : 21 7 Ikuo Okamoto, Tadashi Takemoto, Masami Mizutani, Ikuo Mori. Trans JWRI, 1985: 14(2) : 1 8 Hebd C R. Seances Acad Sci, Ser. C, 1977; 285: 45 [1] 张启运;刘淑祺;许亚平. Cu与液态Sn的相互作用(Ⅱ)——金属间化合物生长的SEM观察[J]. 金属学报, 1992, 28(9): 47-51. Viewed Full text Abstract Cited   Shared      Discussed