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金属学报  1989, Vol. 25 Issue (6): 85-90    
  论文 本期目录 | 过刊浏览 |
Cu与液态Sn的相互作用——兼论润湿曲线的物理意义
张启运;韩万书;刘军钪
北京大学化学系;教授;北京(100871);北京大学;北京大学
INTERACTION BETWEEN Cu AND LIQUID Sn——Also on Physical Meaning of Wetting Curve
ZHANG Oiyun;HAN Wanshu;LIU Junkang Peking University; Beijing ZHANG Qiyun; professor; Department of Chemistry; Peking University 100871
引用本文:

张启运;韩万书;刘军钪. Cu与液态Sn的相互作用——兼论润湿曲线的物理意义[J]. 金属学报, 1989, 25(6): 85-90.
, , . INTERACTION BETWEEN Cu AND LIQUID Sn——Also on Physical Meaning of Wetting Curve[J]. Acta Metall Sin, 1989, 25(6): 85-90.

全文: PDF(1681 KB)  
摘要: 用显微结构方法研究了Cu与液态Sn的相互作用;作出了浸沾时间与Cu溶解扩散的关系图。温度升高至350℃时金属间化合物Cu_6Sn_5的生长有突跃,以羽毛状迅速生长并突破沾Sn层。研究了抑制金属间化合物生长的各种方法。根据上述研究,详细讨论了meniscograph方法所得润湿曲线的物理意义。
关键词 Cu_6Sn_5溶解扩散润湿曲线    
Abstract:The interaction between Cu and liquid Sn was studied by microstruc-ture observation. The curve of the dipping time with related to dissolving anddiffusion of Cu in liquid Sn was given. The Cu dissolves rapidly in liquid Sn atthe beginning, then an intermetallic compound, Cu_6Sn_5, forms, and the dissolvingfollows to slow down. At temperature up to 350℃, the feather-like Cu_6Sn_5 is sud-denly growing up and spreads through the dipped Sn layer. The way to inhibitthe growth of the intermetallic compound, Cu_6Sn_5, was also approached. Thus, onthe above mentioned basis, the phyical meaning of the wetting curve traced by themeniscograph wettability tester has been derived as film detaching, Cu dissolvingand Cu_6Sn_5 growing.
Key wordsCu    liquid Sn    meniscograph    wettability    wetting curve
收稿日期: 1989-06-18     
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[1] 张启运;刘淑祺;许亚平. Cu与液态Sn的相互作用(Ⅱ)——金属间化合物生长的SEM观察[J]. 金属学报, 1992, 28(9): 47-51.